Search International and National Patent Collections
Some content of this application is unavailable at the moment.
If this situation persists, please contact us atFeedback&Contact
1. (WO2012020172) MICROMECHANICAL RESONATOR AND METHOD FOR MANUFACTURING THEREOF
Latest bibliographic data on file with the International Bureau

Pub. No.: WO/2012/020172 International Application No.: PCT/FI2011/050710
Publication Date: 16.02.2012 International Filing Date: 11.08.2011
IPC:
H03H 3/013 (2006.01) ,H03H 9/02 (2006.01) ,H03H 9/24 (2006.01) ,B81B 3/00 (2006.01)
H ELECTRICITY
03
BASIC ELECTRONIC CIRCUITRY
H
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
3
Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
007
for the manufacture of electromechanical resonators or networks
013
for obtaining desired frequency or temperature coefficient
H ELECTRICITY
03
BASIC ELECTRONIC CIRCUITRY
H
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9
Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
02
Details
H ELECTRICITY
03
BASIC ELECTRONIC CIRCUITRY
H
IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
9
Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
24
Constructional features of resonators of material which is not piezo-electric, electrostrictive, or magnetostrictive
B PERFORMING OPERATIONS; TRANSPORTING
81
MICRO-STRUCTURAL TECHNOLOGY
B
MICRO-STRUCTURAL DEVICES OR SYSTEMS, e.g. MICRO-MECHANICAL DEVICES
3
Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
Applicants:
Teknologian tutkimuskeskus VTT [FI/FI]; Vuorimiehentie 3 FI-02150 Espoo, FI (AllExceptUS)
JAAKKOLA, Antti [FI/FI]; FI (UsOnly)
PENSALA, Tuomas [FI/FI]; FI (UsOnly)
Inventors:
JAAKKOLA, Antti; FI
PENSALA, Tuomas; FI
Agent:
SEPPO LAINE OY; Itämerenkatu 3 B FI-00180 Helsinki, FI
Priority Data:
2010585113.08.2010FI
Title (EN) MICROMECHANICAL RESONATOR AND METHOD FOR MANUFACTURING THEREOF
(FR) RÉSONATEUR MICROMÉCANIQUE ET SON PROCÉDÉ DE FABRICATION
Abstract:
(EN) The invention relates to a temperature compensated micromechanical resonator and method of manufacturing thereof. The resonator comprises a resonator element comprising a semiconductor crystal structure, which is doped so as to reduce its temperature coefficient of frequency, transducer means for exciting to the resonator element a vibrational mode. According to the invention the crystal orientation and shape of the resonator element are chosen to allow for a shear mode having a saddle point to be excited to the resonator element, and said transducer means are adapted to excite said shear mode to the resonator element. Accurate micromechanical resonators with low temperature drift can be achieved by means of the invention.
(FR) La présente invention concerne un résonateur micromécanique à compensation thermique et son procédé de fabrication. Le résonateur comprend un élément de résonateur comprenant une structure cristalline à semi-conducteur, qui est dopée afin de réduire son coefficient de température de la fréquence, un moyen transducteur permettant d'exciter un mode de vibration vers l'élément de résonateur. Selon l'invention, l'orientation cristalline et la forme de l'élément de résonateur sont choisies pour permettre un mode de cisaillement présentant un point neutre destiné à être excité vers l'élément de résonateur, et ledit moyen transducteur est conçu pour exciter ledit mode de cisaillement vers l'élément de résonateur. Des résonateurs micromécaniques précis avec dérive de température peuvent être obtenus au moyen de l'invention.
front page image
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, QA, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW
African Regional Intellectual Property Organization (ARIPO) (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG)
Publication Language: English (EN)
Filing Language: English (EN)
Also published as:
EP2603976US20130187724