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1. (WO2011161902) RESIN COMPOSITION USED TO FORM RESIN LAYER OF METAL BASE SUBSTRATE, METAL BASE SUBSTRATE, AND METHOD FOR PRODUCING METAL BASE SUBSTRATE

Pub. No.:    WO/2011/161902    International Application No.:    PCT/JP2011/003402
Publication Date: Dec 29, 2011 International Filing Date: Jun 15, 2011
IPC: C08L 71/10
B32B 15/08
C08K 3/00
C08K 5/54
C08L 63/00
H05K 1/05
Applicants: SUMITOMO BAKELITE CO., LTD.
住友ベークライト株式会社
BABA, Takayuki
馬塲 孝幸
TOBISAWA, Akihiko
飛澤 晃彦
Inventors: BABA, Takayuki
馬塲 孝幸
TOBISAWA, Akihiko
飛澤 晃彦
Title: RESIN COMPOSITION USED TO FORM RESIN LAYER OF METAL BASE SUBSTRATE, METAL BASE SUBSTRATE, AND METHOD FOR PRODUCING METAL BASE SUBSTRATE
Abstract:
Provided is a resin composition used in the formation of a resin layer of a metal base substrate which has a metal sheet, a metal foil, and the resin layer disposed between the metal sheet and the metal foil, wherein the resin composition comprises (A) bisphenol A-type phenoxy resin having a weight-average molecular weight of 4.0×104 to 4.9×104, (B) an inorganic filler, and (C) a silane coupling agent. When the silane coupling agent (C) content of the entire resin composition is c mass% and the inorganic filler (B) content of the entire resin composition is b mass%, the composition satisfies 5×10-2