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Machine translation
1. (WO2011159069) SMART CARD MANUFACTURING METHOD USING INJECTION MOLDING
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2011/159069    International Application No.:    PCT/KR2011/004285
Publication Date: 22.12.2011 International Filing Date: 10.06.2011
IPC:
B29C 45/14 (2006.01), B29C 45/00 (2006.01)
Applicants: PARK, Young Bok [KR/KR]; (KR).
LIM, Hoe Jin [KR/KR]; (KR)
Inventors: PARK, Young Bok; (KR).
LIM, Hoe Jin; (KR)
Agent: MYUNG MOON IP & LAW FIRM; 11F, Songchon Bldg., 642-9 Yeoksam-dong, Gangnam-gu Seoul 135-080 (KR)
Priority Data:
10-2010-0058025 18.06.2010 KR
Title (EN) SMART CARD MANUFACTURING METHOD USING INJECTION MOLDING
(FR) PROCÉDÉ POUR LA FABRICATION D'UNE CARTE À PUCE PAR MOULAGE PAR INJECTION
(KO) 사출 성형을 이용한 스마트카드 제작 방법
Abstract: front page image
(EN)The present invention pertains to a smart card manufacturing method, wherein a card main body may be manufactured to be thin by injection molding in a short period of time, so as to increase productivity and aesthetic sensibility, and improve durability. According to one aspect of the present invention, a method for manufacturing a card main body of a smart card for mounting a structure including a circuit module attached with one or more IC chips includes the steps of: forming an individual sheet by forming a plurality of through-holes for injection molding along the edge of an area on a substrate, in which the card main body is formed, and forming one or more through-holes for chip insertion at positions for IC chips to be inserted; and forming injection molds on the edge with a predetermined thickness and predetermined width by injection-molding a melt along the edge of the individual sheet.
(FR)La présente invention concerne un procédé pour la fabrication d'une carte à puce, caractérisé en ce qu'un corps principal de carte peut être fabriqué sous forme mince par moulage par injection sur une courte durée, de façon à accroître la productivité et les qualités esthétiques, tout en améliorant la durabilité. Selon un aspect de la présente invention, un procédé de fabrication d'un corps principal de carte à puce destiné au montage d'une structure comprenant un module de circuit équipé d'une ou plusieurs puces à CI comporte les étapes consistant à : former une feuille individuelle en formant une pluralité de trous débouchants de moulage par injection le long du bord d'une zone d'un substrat dans lequel est formé le corps principal de carte, et former un ou plusieurs trous débouchants d'insertion de puces dans des positions où des puces à CI doivent être insérées ; et former des éléments moulés par injection sur le bord, présentant une épaisseur prédéterminée et une largeur prédéterminée, en moulant par injection un matériau fondu le long du bord de la feuille individuelle.
(KO)본 발명은 사출 성형으로 카드 본체를 신속하고 박형으로 제작하여 생산성을 높일 수 있고 심미감을 증대시키며, 내구성을 향상시킬 수 있는 구조로 제작 가능한 스마트카드 제작 방법에 관한 것이다. 본 발명의 일면에 따른, 하나 이상의 IC 칩을 부착한 회로 모듈을 포함한 구조물을 장착하기 위한 스마트카드의 카드 본체를 제작하는 방법은, 기판에 상기 카드 본체가 형성될 영역의 가장 자리를 따라 복수의 사출 성형용 관통홀들을 형성하고, 상기 IC 칩이 삽입될 위치에 하나 이상의 칩 삽입용 관통홀을 형성하여, 개별 시트를 제작하는 단계; 및 상기 개별 시트의 상기 가장 자리를 따라 용융물을 사출하여 일정 두께와 폭으로 상기 가장 자리에 사출 성형물을 형성하는 단계를 포함한다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)