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1. (WO2011158731) SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING THE SUBSTRATE

Pub. No.:    WO/2011/158731    International Application No.:    PCT/JP2011/063266
Publication Date: Dec 22, 2011 International Filing Date: Jun 9, 2011
IPC: H01L 23/12
H01L 21/60
H01L 23/28
H05K 3/24
Applicants: Sumitomo Metal Mining Co., Ltd.
住友金属鉱山株式会社
KAMOHARA, Hidehiko
蒲原 英彦
MIKAMI, Juntarou
三上 順太郎
Inventors: KAMOHARA, Hidehiko
蒲原 英彦
MIKAMI, Juntarou
三上 順太郎
Title: SUBSTRATE FOR MOUNTING SEMICONDUCTOR ELEMENT AND METHOD FOR MANUFACTURING THE SUBSTRATE
Abstract:
Disclosed is a substrate for mounting a semiconductor element, which has a terminal section having excellent bonding performance with a sealing resin and excellent connecting characteristics with a bonding wire, and which can reduce manufacture cost and is sufficiently applicable to miniaturizing and thinning of a semiconductor device. Also disclosed is a method for manufacturing such substrate. The substrate at least has the terminal section (3), which has a layered section (12) configured of a plurality of layers wherein adjacent layers (10, 11) are respectively composed of a same kind of metal or alloy with different average crystal grain sizes, and which has a recessed section formed by etching on the side surface of the layered section (12), said recessed section having a step between the adjacent layers (10, 11).