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Machine translation
1. (WO2011156537) HIGH VOLTAGE LOW CURRENT SURFACE-EMITTING LED
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2011/156537    International Application No.:    PCT/US2011/039696
Publication Date: 15.12.2011 International Filing Date: 09.06.2011
IPC:
H01L 33/00 (2010.01)
Applicants: CREE, INC. [US/US]; 4600 Silicon Drive Durham, NC 27703 (US) (For All Designated States Except US).
IBBETSON, James [GB/US]; (US) (For US Only).
HEIKMAN, Sten [SE/US]; (US) (For US Only)
Inventors: IBBETSON, James; (US).
HEIKMAN, Sten; (US)
Agent: MYERS BIGEL SIBLEY & SAJOVEC, P.A.; P.O. Box 37428 Raleigh, NC 27627 (US)
Priority Data:
12/814,241 11.06.2010 US
Title (EN) HIGH VOLTAGE LOW CURRENT SURFACE-EMITTING LED
(FR) DEL À ÉMISSION PAR LA SURFACE, À HAUTE TENSION ET FAIBLE COURANT
Abstract: front page image
(EN)An LED chip comprising a plurality of sub-LEDs on a submount. Electrically conductive and electrically insulating features are included that serially interconnect the sub-LEDs such that an electrical signal applied to the serially interconnected sub-LEDs along the electrically conductive features spreads to the serially interconnected sub-LEDs. A via is included that is arranged to electrically couple one of the sub-LEDs to the submount. The sub-LED can be interconnected by more than one of the conductive features, with each one of the conductive features capable of spreading an electrical signal between the two of the sub-LEDs.
(FR)L'invention concerne une puce DEL comprenant une pluralité de sous-DEL sur un support. Des éléments électriquement conducteurs et électriquement isolants relient en série les sous-DEL de telle sorte qu'un signal électrique appliqué aux sous-DEL reliées en série le long des éléments électriquement conducteurs se propage aux sous-DEL reliées en série. Un trou d'interconnexion est disposé pour coupler électriquement l'une des sous-DEL au support. La sous-DEL peut être interconnectée par plusieurs des éléments conducteurs, chacun d'entre eux étant capable de propager un signal électrique entre deux des sous-DEL.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)