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1. WO2011152230 - LASER PROCESSING METHOD

Publication Number WO/2011/152230
Publication Date 08.12.2011
International Application No. PCT/JP2011/061674
International Filing Date 20.05.2011
IPC
B23K 26/38 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
38by boring or cutting
B23K 26/073 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06Shaping the laser beam, e.g. by masks or multi-focusing
073Shaping the laser spot
B23K 26/40 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
40taking account of the properties of the material involved
C03B 33/09 2006.1
CCHEMISTRY; METALLURGY
03GLASS; MINERAL OR SLAG WOOL
BMANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL; SUPPLEMENTARY PROCESSES IN THE MANUFACTURE OR SHAPING OF GLASS, OR OF MINERAL OR SLAG WOOL
33Severing cooled glass
09by thermal shock
H01L 21/301 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301to subdivide a semiconductor body into separate parts, e.g. making partitions
CPC
B23K 2101/40
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2101Articles made by soldering, welding or cutting
36Electric or electronic devices
40Semiconductor devices
B23K 2103/50
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2103Materials to be soldered, welded or cut
50Inorganic material, e.g. metals, not provided for in B23K2103/02B23K2103/26
B23K 26/0622
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06Shaping the laser beam, e.g. by masks or multi-focusing
062by direct control of the laser beam
0622by shaping pulses
B23K 26/38
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
38by boring or cutting
B23K 26/40
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
40taking account of the properties of the material involved
B23K 26/53
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
50Working by transmitting the laser beam through or within the workpiece
53for modifying or reforming the material inside the workpiece, e.g. for producing break initiation cracks
Applicants
  • 浜松ホトニクス株式会社 HAMAMATSU PHOTONICS K.K. [JP]/[JP] (AllExceptUS)
  • 杉浦 隆二 SUGIURA Ryuji [JP]/[JP] (UsOnly)
Inventors
  • 杉浦 隆二 SUGIURA Ryuji
Agents
  • 長谷川 芳樹 HASEGAWA Yoshiki
Priority Data
2010-12704502.06.2010JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LASER PROCESSING METHOD
(FR) PROCÉDÉ DE TRAITEMENT AU LASER
(JA) レーザ加工方法
Abstract
(EN)
Provided is a laser processing method capable of increasing splitting force according to the required quality. By irradiating an object to be processed with laser light (L) having a pulse waveform with a half-value width and a bottom width that are equal to each other, a plurality of modified spots are formed along a planned cut line in the object to be processed, and a modified region is formed by the plurality of modified spots. A laser light source (101) controls a drive power source (51) by a laser light source control unit (102) to switch the pulse waveform between first to third pulse waveforms according to the PE value of the laser light (L). When the PE value is low, the first pulse waveform configured to have a peak value located on the first half side thereof and a saw-edged shape is set as the pulse waveform, and when the PE value is high, the second pulse waveform configured to have a peak value located on the second half side thereof and a saw-edged shape is set as the pulse waveform.
(FR)
La présente invention se rapporte à un procédé de traitement au laser pouvant augmenter la force de division en fonction de la qualité requise. L'exposition d'un objet devant être traité à une lumière laser (L) ayant une forme d'onde d'impulsion ayant une largeur de demi-atténuation et une largeur de fond mutuellement égales permet la formation de plusieurs spots modifiés le long d'une ligne de découpe prévue dans l'objet devant être traité, et une région modifiée est formée par la pluralité de spots modifiés. Une source de lumière laser (101) commande une source de puissance d'entraînement (51) par une unité de commande de source de lumière laser (102) pour commuter la forme d'onde d'impulsion entre des première à troisième formes d'onde d'impulsion en fonction de la valeur PE de la lumière laser (L). Lorsque la valeur PE est faible, la première forme d'onde d'impulsion conçue pour avoir une valeur de crête située sur sa première moitié et une forme à redents est définie comme forme d'onde d'impulsion, et lorsque la valeur PE est élevée, la deuxième forme d'onde d'impulsion conçue pour avoir une valeur de crête située sur sa seconde moitié et une forme à redents est définie comme forme d'onde d'impulsion.
(JA)
 要求される品質に応じて分割力を高めることができるレーザ加工方法を提供する。半値幅と裾幅とが互いに等しいパルス波形を有するレーザ光Lを加工対象物に照射することで、切断予定ラインに沿って改質スポットを加工対象物内に複数形成し、複数の改質スポットによって改質領域を形成する。ここで、レーザ光源(101)は、レーザ光源制御部(102)によって駆動電源51を制御し、レーザ光LのPE値に応じてパルス波形を第1~第3パルス波形の間で切り替える。低PE値の場合、その前半側にピーク値が位置し且つ鋸刃状となるよう構成された第1パルス波形をパルス波形として設定すると共に、高PE値の場合、その後半側にピーク値が位置し且つ鋸刃状となるよう構成された第2パルス波形をパルス波形として設定する。
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