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1. (WO2011150738) CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2011/150738    International Application No.:    PCT/CN2011/074076
Publication Date: 08.12.2011 International Filing Date: 16.05.2011
IPC:
H05K 1/02 (2006.01), H05K 3/46 (2006.01)
Applicants: HUAWEI TECHNOLOGIES CO., LTD. [CN/CN]; Huawei Administration Building Bantian, Longgang District Shenzhen, Guangdong 518129 (CN) (For All Designated States Except US).
GAO, Feng [CN/CN]; (CN) (For US Only).
LIU, Shandang [CN/CN]; (CN) (For US Only).
ZONG, Xuan [CN/CN]; (CN) (For US Only)
Inventors: GAO, Feng; (CN).
LIU, Shandang; (CN).
ZONG, Xuan; (CN)
Agent: SHENPAT INTELLECTUAL PROPERTY AGENCY; Room 1521 West Block, Guomao Building Shenzhen, Guangdong 518014 (CN)
Priority Data:
201010564278.3 25.11.2010 CN
Title (EN) CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
(FR) CARTE À CIRCUIT ET PROCÉDÉ POUR SA FABRICATION
(ZH) 一种电路板及其制作方法
Abstract: front page image
(EN)A circuit board (100) and a manufacturing method thereof are provided. The circuit board (100) comprises at least one adhesive layer (120) and at least one transmission line (140), an air cavity (124) is formed in the adhesive layer (120), and an orthographic projection of the transmission line (140) is located in the area of the air cavity (124) of the adhesive layer (120).
(FR)L'invention concerne une carte (100) à circuit et un procédé pour sa fabrication. La carte (100) à circuit comporte au moins une couche adhésive (120) et au moins une ligne (140) de transmission, une cavité (124) d'air est formée dans la couche adhésive (120) et une projection orthographique de la ligne (140) de transmission est située dans la zone de la cavité (124) d'air de la couche adhésive (120).
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)