WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2011149312) HEAT-DISSIPATING STRUCTURE FOR AN LED LAMP
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2011/149312    International Application No.:    PCT/KR2011/003923
Publication Date: 01.12.2011 International Filing Date: 27.05.2011
IPC:
F21V 29/00 (2006.01)
Applicants: LIM, Yeong Soo [KR/KR]; (KR)
Inventors: LIM, Yeong Soo; (KR)
Agent: CHOI, Young-Min; Vniel B/D 2F 1362-9 Seocho-dong Seocho-gu Seoul 137-070 (KR)
Priority Data:
10-2010-0050056 28.05.2010 KR
Title (EN) HEAT-DISSIPATING STRUCTURE FOR AN LED LAMP
(FR) STRUCTURE DE DISSIPATION DE CHALEUR POUR UNE LAMPE À DIODES ÉLECTROLUMINESCENTES
(KO) 엘이디 램프의 방열구조
Abstract: front page image
(EN)The present invention relates to a heat-dissipating structure for an LED lamp, which is lightweight and has a maximized heat-dissipating area. The heat-dissipating structure for an LED lamp comprises a frame and a heat-dissipating member. The frame includes: an upper disk having an upper surface on which a power supply unit is arranged; a lower disk having a lower surface on which an LED substrate equipped with a plurality of high-luminance LEDs are arranged; and a rod-shaped connection member, both ends of which are fixed at the center of a lower surface of the upper disk and at the center of an upper surface of the lower disk, respectively, so as to integrally connect the upper disk and the lower disk, and the interior of which is hollow and in which a power cable is installed. The heat-dissipating member is fixed between the upper disk and the lower disk of the frame, and is formed into layers of disks, wherein each disk is made of two or more members which are in contact with each other so as to form an annular plane. The disks are continuously overlapped with each other to form a plurality of stacked layers. The diameter of the disk in each layer gradually increases from top to bottom.
(FR)La présente invention porte sur une structure de dissipation de chaleur pour une lampe à diodes électroluminescentes, laquelle structure est de faible poids et a une surface de dissipation de chaleur maximisée. La structure de dissipation de chaleur pour une lampe à diodes électroluminescentes comprend un bâti et un élément de dissipation de chaleur. Le bâti comprend : un disque supérieur ayant une surface supérieure sur laquelle est disposée une unité d'alimentation ; un disque inférieur ayant une surface inférieure sur laquelle est disposée un substrat de diodes électroluminescentes comportant une pluralité de diodes électroluminescentes à haute luminance ; et un élément de liaison en forme de tige, dont les deux extrémités sont fixées au centre d'une surface inférieure du disque supérieur et au centre d'une surface supérieure du disque inférieur, respectivement, de façon à relier d'une seule pièce le disque supérieur et le disque inférieur, et dont l'intérieur est creux et dans lequel est installé un câble d'alimentation. L'élément de dissipation de chaleur est fixé entre le disque supérieur et le disque inférieur du bâti, et est formé sous la forme de couches de disques, chaque disque étant constitué par deux ou plus de deux éléments qui sont en contact les uns avec les autres de façon à former une plaque annulaire. Les disques se chevauchent mutuellement de façon continue de façon à former une pluralité de couches empilées. Le diamètre du disque dans chaque couche augmente graduellement de haut en bas.
(KO)중량이 가볍고 방열면적이 극대화된 엘이디 램프의 방열구조가 개시된다. 엘이디 램프의 방열구조는, 상면에 전원부가 설치되는 원판형상의 상판과, 하면에 다수 개의 고휘도 엘이디가 구비된 엘이디 기판이 설치되는 원판형상의 하판과, 상판의 하면 및 하판의 상면 중앙에 그 양단이 고정되어 상기 상판 및 하판을 일체로 연결하며 관통된 내부에 전원케이블이 설치되는 봉형상의 연결부재로 이루어진 프레임 및; 프레임의 상판 및 하판 사이에 고정 설치되며, 적어도 2개 이상의 부재가 맞닿아 평면이 원형상을 갖도록 이루어지고, 각 부재는 판형의 부재가 연속적으로 절첩되어 다수 적층된 구조로 이루어짐과 아울러 각 층은 상측에서 하측을 향해 점차 직경이 증가되도록 이루어진 방열부재;를 포함한다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)