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1. (WO2011147124) LED STREET LAMP AND HIGH POWER LED DEVICE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2011/147124    International Application No.:    PCT/CN2010/075828
Publication Date: 01.12.2011 International Filing Date: 10.08.2010
IPC:
F21S 2/00 (2006.01), H01L 33/00 (2010.01), H01L 25/075 (2006.01)
Applicants: SHENZHEN JUFEI OPTOELECTRONICS CO., LTD. [CN/CN]; 65, Chuangyi Street, Gaofeng Community, Dalang, Baoan District Shenzhen, Guangdong 518109 (CN) (For All Designated States Except US).
SUN, Pingru [CN/CN]; (CN) (For US Only)
Inventors: SUN, Pingru; (CN)
Agent: DHC LAW OFFICE; Suite 2201, Modern International Commercial Building Cross of Fuhua Road and Jintian Road Futian District, Shenzhen Guangdong 518048 (CN)
Priority Data:
201010186112.2 28.05.2010 CN
Title (EN) LED STREET LAMP AND HIGH POWER LED DEVICE
(FR) RÉVERBÈRE À DEL ET DISPOSITIF À DEL HAUTE PUISSANCE
(ZH) 一种LED路灯和大功率LED器件
Abstract: front page image
(EN)An LED street lamp and a high power LED device are provided. The LED street lamp comprises a base plate (1) and at least one LED chip (3). The base plate is a silicon base plate. A metal interconnection layer used for leading out the electrodes of the LED chip is plated on the upper surface of the silicon base plate. A nanometer silver film (22) is plated on the upper surface of the metal interconnection layer. The LED chip is fixed on the metal interconnection layer plated with nanometer silver film by eutectic welding.
(FR)L'invention concerne un réverbère à DEL et un dispositif à DEL haute puissance. Le réverbère à DEL comprend une plaque de base (1) et au moins une puce de DEL (3). La plaque de base est une plaque de base en silicium. Une couche d'interconnexion métallique utilisée pour diriger les électrodes de la puce de DEL vers l'extérieur est plaquée sur la surface supérieure de la plaque de base en silicium. Un film de nano-argent (22) est plaqué sur la surface supérieure de la couche d'interconnexion métallique. La puce de DEL est fixée sur la couche d'interconnexion métallique plaquée avec le film de nano-argent par soudure eutectique.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)