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Machine translation
1. (WO2011147099) ARRANGEMENT WITH CHIP AND CARRIER
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2011/147099    International Application No.:    PCT/CN2010/073354
Publication Date: 01.12.2011 International Filing Date: 28.05.2010
IPC:
H01L 23/24 (2006.01), H01L 23/485 (2006.01)
Applicants: HUAWEI TECHNOLOGIES CO.,LTD. [CN/CN]; Huawei Administration Building,Bantian, Longgang Shenzhen, Guangdong 518129 (CN) (For All Designated States Except US).
LEIF, Bergstedt [SE/SE]; (SE) (For US Only)
Inventors: LEIF, Bergstedt; (SE)
Priority Data:
Title (EN) ARRANGEMENT WITH CHIP AND CARRIER
(FR) AGENCEMENT COMPRENANT UNE PUCE ET UN SUPPORT
Abstract: front page image
(EN)Chip (1) and a carrier (2) of the chip are disclosed, where a ridge (4) is positioned between the chip (1) and the carrier (2), which ridge (4) is adapted to increase the thermal contact between the chip (1) and the carrier (2). Example 5 use is attachment to a contact surface (21) on the carrier (2) by means of an adhesive member (3).
(FR)L'invention porte sur une puce (1) et sur un support (2) de la puce, dans lesquels une arête (4) est positionnée entre la puce (1) et le support (2), laquelle arête (4) est adaptée à accroître le contact thermique entre la puce (1) et le support (2). Un exemple d'utilisation est la fixation à une surface de contact (21) sur le support (2) à l'aide d'un élément adhésif (3).
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)