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1. (WO2011146122) MATERIALS AND METHODS FOR INSULATING ELECTRONIC COMPONENTS AND DEVICES
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2011/146122    International Application No.:    PCT/US2011/000888
Publication Date: 24.11.2011 International Filing Date: 18.05.2011
IPC:
A61N 1/05 (2006.01)
Applicants: TRONICS MEDTECH [US/US]; 1525 Mccarthy Blvd., Ste. 212 Milpitas, CA 95035 (US) (For All Designated States Except US).
STONE, Robert, T. [US/US]; (US) (For All Designated States Except US)
Inventors: STONE, Robert, T.; (US)
Agent: FRANCIS, Ralph, C.; Francis Law Group 1942 Embarcadero Oakland, CA 94606 (US)
Priority Data:
13/067,000 28.04.2011 US
61/396,097 20.05.2010 US
Title (EN) MATERIALS AND METHODS FOR INSULATING ELECTRONIC COMPONENTS AND DEVICES
(FR) MATÉRIAUX ET PROCÉDÉS D'ISOLATION DE COMPOSANTS ÉLECTRONIQUES ET DISPOSITIFS ASSOCIÉS
Abstract: front page image
(EN)A method for insulating an electronic component, comprising encapsulating the electronic component with an electrically insulating pouch having a first protective layer and a second electrically insulating layer, the first protective layer comprising a flexible polymeric material, the second electrically insulating layer comprising the parylene layer.
(FR)L'invention porte sur un procédé d'isolation d'un composant électronique, lequel procédé comprend l'encapsulation du composant électronique avec une poche électriquement isolante ayant une première couche de protection et une seconde couche électriquement isolante, la première couche de protection comprenant un matériau polymère souple, la seconde couche électriquement isolante comprenant la couche de parylène.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)