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1. (WO2011145828) PRINTED CIRCUIT BOARD INCLUDING A DAM FOR UNDERFILLS, AND METHOD FOR MANUFACTURING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2011/145828    International Application No.:    PCT/KR2011/003466
Publication Date: 24.11.2011 International Filing Date: 11.05.2011
IPC:
H01L 21/60 (2006.01)
Applicants: LG CHEM, LTD. [KR/KR]; 20, Yoido-dong, Youngdungpo-gu, Seoul 150-721 (KR) (For All Designated States Except US).
CHOI, Byung-Ju [KR/KR]; (KR) (For US Only).
JEONG, Woo-Jae [KR/KR]; (KR) (For US Only).
CHOI, Bo-Yun [KR/KR]; (KR) (For US Only).
LEE, Kwang-Joo [KR/KR]; (KR) (For US Only).
JEONG, Min-Su [KR/KR]; (KR) (For US Only)
Inventors: CHOI, Byung-Ju; (KR).
JEONG, Woo-Jae; (KR).
CHOI, Bo-Yun; (KR).
LEE, Kwang-Joo; (KR).
JEONG, Min-Su; (KR)
Agent: YOU ME PATENT & LAW FIRM; Seolim Bldg. 649-10, Yoksam-dong Kangnam-ku, Seoul 135-080 (KR)
Priority Data:
10-2010-0047318 20.05.2010 KR
10-2011-0044011 11.05.2011 KR
Title (EN) PRINTED CIRCUIT BOARD INCLUDING A DAM FOR UNDERFILLS, AND METHOD FOR MANUFACTURING SAME
(FR) CARTE DE CIRCUITS IMPRIMÉS COMPRENANT UN BARRAGE POUR MATÉRIAUX DE COMBLEMENT À MANQUE DE MATIÈRE, ET PROCÉDÉ POUR SA FABRICATION
(KO) 언더-필용 댐을 포함하는 인쇄 회로 기판 및 이의 제조 방법
Abstract: front page image
(EN)The present invention relates to a dam for underfills, which has excellent detectivity. For a dam which is formed in the shape of a fence around a chip to prevent the leakage of underfills filled between a substrate and the chip, a dam for underfills, which is composed of a dry-film-type solder resist, is provided.
(FR)La présente invention porte sur un barrage pour matériaux de comblement à manque de matière, lequel barrage a une excellente détectivité. Comme barrage qui est formé sous la forme d'une barrière autour d'une puce afin d'empêcher la fuite de matériaux de comblement à manque de matière remplissant l'espace entre un substrat et la puce, un barrage pour matériaux de comblement à manque de matière, qui est constitué par une réserve de soudure du type à film sec, est disposé.
(KO)본 발명은 검출력이 우수한 언더 필용 댐에 관한 것으로, 기판과 칩 소자 사이에 채워 넣는 언더 필의 누출을 방지하기 위해 칩 소자 주위에 울타리 형태로 형성되는 댐에 있어서, 댐이 드라이 필름 타입의 솔더 레지스트로 이루어진 것을 특징으로 하는 언더 필용 댐을 제공한다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)