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Machine translation
1. (WO2011142643) COPPER ALLOY, METHOD FOR PREPARING SAME, AND ENHANCING STRENGTH AND ELECTRICAL CONDUCTIVITY THEREOF
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2011/142643    International Application No.:    PCT/KR2011/003604
Publication Date: 17.11.2011 International Filing Date: 16.05.2011
IPC:
C22C 9/06 (2006.01), C22F 1/08 (2006.01)
Applicants: KOREA INSTITUTE OF MACHINERY & MATERIALS [KR/KR]; 171, Jang-dong, Yooseong-gu Daejeon 305-343 (KR) (For All Designated States Except US).
EUH, Kwangjun [KR/KR]; (KR) (For US Only).
HAN, Seung Zeon [KR/KR]; (KR) (For US Only)
Inventors: EUH, Kwangjun; (KR).
HAN, Seung Zeon; (KR)
Agent: NA, Dong Kyu; 302. Oh-Sung Bldg. 1508, Dunsan 1-dong Seo-Gu Daejeon 302-831 (KR)
Priority Data:
10-2010-0045570 14.05.2010 KR
10-2011-0045497 16.05.2011 KR
Title (EN) COPPER ALLOY, METHOD FOR PREPARING SAME, AND ENHANCING STRENGTH AND ELECTRICAL CONDUCTIVITY THEREOF
(FR) ALLIAGE DE CUIVRE, SON PROCÉDÉ DE PRÉPARATION, ET AMÉLIORATION DE LA RÉSISTANCE ET DE LA CONDUCTIVITÉ ÉLECTRIQUE DUDIT ALLIAGE
(KO) 구리합금 및 그 제조방법과 그 강도와 전기전도도를 향상시키는 방법
Abstract: front page image
(EN)The present invention relates to a copper alloy having enhanced strength and electrical conductivity, which is provided with nickel and silicon as primary alloyed elements, with copper and unavoidable impurities forming the remainder, and titanium is added to the alloy in place of silicon in order to induce precipitation of nickel and intermetallic compounds, and a method for preparing the copper alloy. Additionally, the present invention relates to a semiconductor lead frame and a connector for electronic materials manufactured using the copper alloy. Furthermore, the present invention relates to a method for enhancing the strength and electrical conductivity of the copper alloy comprising the following steps: preparing an alloy including copper, nickel, and silicon, and adding a component that improves precipitation driving force; quenching the prepared alloy; generating a lamellar or fiber precipitate for all crystal-grains that make up the alloy by heat-treating the prepared alloy; and arranging the lamellar or fiber precipitate in one direction across the overall texture.
(FR)La présente invention concerne un alliage de cuivre à résistance et conductivité électrique améliorées, qui comprend du nickel et du silicium en tant qu'éléments principaux d'alliage, du cuivre et les impuretés inévitables constituant la partie restante, et du titane ajouté à l'alliage au lieu du silicium afin d'induire la précipitation du nickel et des composés intermétalliques de façon que des éléments supplémentaires puissent être ajoutés à l'alliage; ainsi qu'un procédé de préparation dudit alliage de cuivre. La présente invention concerne également une grille de connexion pour semi-conducteurs et un connecteur pour des matériaux électroniques fabriqués au moyen de l'alliage de cuivre. L'invention concerne en outre un procédé pour améliorer la résistance et la conductivité électrique de l'alliage de cuivre qui comprend les étapes consistant : à préparer un alliage contenant du cuivre, du nickel et du silicium, et à ajouter un composant qui améliore la force d'entraînement de précipitation; à tremper l'alliage préparé; à générer un précipité lamellaire ou fibreux pour tous les grains cristallins qui constituent l'alliage par traitement thermique de l'alliage préparé; et à disposer le précipité lamellaire ou fibreux dans une direction sur toute la surface de la texture.
(KO)본 발명은 니켈(Ni)과 실리콘(Si)이 합금화 원소이고, 나머지는 구리와 불가피한 불순물이 잔부를 이루는 구리합금 속에 티타늄(Ti)이 상기 구리합금 속에 실리콘을 대신하여 니켈과 금속간화합물의 석출을 유도하기 위해 추가의 합금화 원소로 첨가된, 강도와 전기전도도가 향상된 구리합금 및 이의 제조방법에 관한 것이다. 또한 이렇게 제조된 구리합금으로 제조된 반도체 리드프레임과 전자 부품용 커넥터에 관한 것이다. 또한, 구리, 니켈, 실리콘을 포함하고, 석출 구동력을 향상시키는 성분을 첨가하여 합금을 제조하는 단계와, 상기 제조된 합금을 급냉하는 단계와, 상기 제조된 합금을 열처리하여, 합금을 구성하고 있는 결정립 전반에 걸쳐 층상(Lamellar) 혹은 섬유상(Fiber)의 석출물을 생성시키는 단계와, 상기 층상 혹은 섬유상 석출물이 전체 조직에 걸쳐 일방향으로 배열되게 하는 단계를 포함하는, 구리합금의 강도와 전기전도도를 향상시키는 방법에 관한 것이다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)