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1. (WO2011142401) ADHESIVE TAPE FOR PROCESSING RIGID WAFERS AND GRINDING METHOD USING SAME
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2011/142401    International Application No.:    PCT/JP2011/060890
Publication Date: 17.11.2011 International Filing Date: 11.05.2011
IPC:
H01L 21/304 (2006.01), C09J 7/02 (2006.01)
Applicants: FURUKAWA ELECTRIC CO., LTD. [JP/JP]; 2-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo 1008322 (JP) (For All Designated States Except US).
UCHIYAMA, Tomoaki [JP/JP]; (JP) (For US Only).
OKA, Yoshifumi [JP/JP]; (JP) (For US Only).
YANO, Shozo [JP/JP]; (JP) (For US Only).
ISHIWATA, Shinichi [JP/JP]; (JP) (For US Only)
Inventors: UCHIYAMA, Tomoaki; (JP).
OKA, Yoshifumi; (JP).
YANO, Shozo; (JP).
ISHIWATA, Shinichi; (JP)
Agent: IIDA, Toshizo; ISHII Bldg. 3F, 1-10, Shimbashi 3-chome, Minato-ku, Tokyo 1050004 (JP)
Priority Data:
2010-111942 14.05.2010 JP
Title (EN) ADHESIVE TAPE FOR PROCESSING RIGID WAFERS AND GRINDING METHOD USING SAME
(FR) RUBAN ADHÉSIF POUR LE TRAITEMENT DE TRANCHES RIGIDES ET PROCÉDÉ DE MEULAGE UTILISANT CE RUBAN
(JA) 硬質ウエハ加工用粘着テープ及びそれを用いた研削方法
Abstract: front page image
(EN)The disclosed adhesive tape for processing rigid wafers has a radiation-curable adhesive layer on top of a base resin film layer that contains a polyester. Prior to radiation curing, the disclosed adhesive tape exhibits compressive displacement between 30 and 92 μm and an adhesive strength, with respect to a mirror surface of a silicon wafer, between 2.5 and 29.8 N/25 mm.
(FR)L'invention porte sur un ruban adhésif servant au traitement de tranches rigides. Le ruban adhésif selon l'invention possède une couche adhésive durcissable par irradiation sur une couche de film de résine de base qui contient un polyester. Avant le durcissement par irradiation, le ruban adhésif selon l'invention présente un déplacement par compression d'entre 30 et 92 µm et une force adhésive par rapport à une surface spéculaire d'une tranche de silicium d'entre 2,5 et 29,8 N/25 mm.
(JA) 基材樹脂フィルム層上に放射線硬化性の粘着剤層を有する硬質ウエハ加工用粘着テープであって、前記基材樹脂フィルムがポリエステルを含み、該粘着テープのシリコンウエハのミラー面に対する放射線硬化前の粘着力が2.5~29.8N/25mmで、かつ該粘着テープの放射線硬化前の圧縮変位量が30~92μmである硬質ウエハ加工用粘着テープ。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)