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Pub. No.:    WO/2011/142318    International Application No.:    PCT/JP2011/060658
Publication Date: 17.11.2011 International Filing Date: 09.05.2011
H01L 23/12 (2006.01), H01B 1/22 (2006.01), H01L 21/60 (2006.01)
Applicants: TDK CORPORATION [JP/JP]; 1-13-1, Nihonbashi, Chuo-ku, Tokyo 1038272 (JP) (For All Designated States Except US).
NORITAKE CO.,LIMITED [JP/JP]; 3-1-36, Noritakeshinmachi, Nishi-ku, Nagoya-shi, Aichi 4518501 (JP) (For All Designated States Except US).
SATOH, Minoru [JP/JP]; (JP) (For US Only).
YAMASHITA Takehiro [JP/JP]; (JP) (For US Only).
NAGAI Atsushi [JP/JP]; (JP) (For US Only).
ADACHI Yasuo [JP/JP]; (JP) (For US Only)
Inventors: SATOH, Minoru; (JP).
YAMASHITA Takehiro; (JP).
NAGAI Atsushi; (JP).
ADACHI Yasuo; (JP)
Agent: ABE Makoto; Kyodo Patent Law Firm, 47KT Bldg., 10th Floor, 3-20-3, Marunouchi, Naka-ku, Nagoya-shi, Aichi 4600002 (JP)
Priority Data:
2010-109596 11.05.2010 JP
(JA) 電子部品及びその製造方法
Abstract: front page image
(EN)Provided is an electronic component that is, on the surface of a substrate, provided with a wet-solder-less conductor film having excellent wire-bonding properties. The electronic component (10) is provided with: an inorganic substrate (20); a conductor film (30) formed at the surface of said substrate; and bonding wires (50, 55) bonded to a portion of said conductor film. Wire bonding sections (40, 45) are formed to at least a portion of the electronic component (10). At least the portion of the conductor film to which the wire bonding sections are formed contains: an Ag-based metal comprising Ag or an alloy having Ag as the main constituent; and a metal oxide that coats said Ag-based metal and that has as a constituent element any of the elements selected from the group consisting of Al, Zr, Ti, Y, Ca, Mg, and Zn. The coating amount of the metal oxide is an amount corresponding to 0.02-0.1 masses for every 100 masses of the Ag-based metal.
(FR)La présente invention concerne un composant électronique qui est, à la surface d'un substrat, doté d'un film conducteur exempt de soudure humide présentant d'excellentes propriétés de microcâblage. Le composant électronique (10) est doté: d'un substrat inorganique (20) ; d'un film conducteur (30) formé à la surface dudit substrat ; et des fils de connexion (50, 55) soudés à une partie dudit film conducteur. Des sections de microcâblage (40, 45) sont formées à au moins une partie du composant électronique (10). Au moins la partie du film conducteur à laquelle les sections de microcâblage sont formées contient : un métal à base d'Ag comportant Ag ou un alliage comprenant Ag comme constituant principal ; et un oxyde métallique qui recouvre ledit métal à base d'Ag et comprend comme élément constitutif un quelconque des éléments choisis parmi le groupe constitué de Al, Zr, Ti, Y, Ca, Mg, et Zn. La quantité de revêtement de l'oxyde métallique est une quantité correspondant à 0,02 - 0,1 en masse pour chaque 100 en masse du métal à base d'Ag.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)