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Machine translation
1. (WO2011139606) METHOD FOR TRACING INDIVIDUAL DIES
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2011/139606    International Application No.:    PCT/US2011/033611
Publication Date: 10.11.2011 International Filing Date: 22.04.2011
IPC:
H01L 23/544 (2006.01)
Applicants: MEDTRONIC, INC. [US/US]; 710 Medtronic Parkway MS LC340 Minneapolis, Minnesota 55432 (US) (For All Designated States Except US).
MEYERSON, Charles, M. [US/US]; (US) (For US Only).
DICKES, Eric, J. [US/US]; (US) (For US Only).
GORTON, William, V. [US/US]; (US) (For US Only).
GRAHAM, Stephen, W. [US/US]; (US) (For US Only).
HEAMES, Kenneth [US/US]; (US).
JOHNSON, Dennis, B. [US/US]; (US) (For US Only).
OHME, Christopher, D. [US/US]; (US) (For All Designated States Except US).
WARREN, Steven, C. [US/US]; (US) (For US Only)
Inventors: MEYERSON, Charles, M.; (US).
DICKES, Eric, J.; (US).
GORTON, William, V.; (US).
GRAHAM, Stephen, W.; (US).
HEAMES, Kenneth; (US).
JOHNSON, Dennis, B.; (US).
WARREN, Steven, C.; (US)
Agent: BARDELL, Scott; 710 Medtronic Parkway Ms LC340 Minneapolis, MN 55432 (US)
Priority Data:
12/767,231 26.04.2010 US
Title (EN) METHOD FOR TRACING INDIVIDUAL DIES
(FR) PROCÉDÉ DE SUIVI DE PASTILLES INDIVIDUELLES
Abstract: front page image
(EN)A method for tracing individual dies (12) within stacked chip scale packages includes the steps of recording unique die identifiers (14) from layers of marked dies and associating the unique identifiers with a die bonding substrate and the resulting die or stacked chip scale packages. The unique die identifiers are also associated with wafer numbers, x-y positions on a wafer, wafer lot numbers or any combination thereof.
(FR)Procédé de suivi de pastilles individuelles (12) au sein de boîtiers empilés à l'échelle d'une puce, comportant les étapes consistant à enregistrer des identifiants uniques de pastilles (14) à partir de couches de pastilles marquées et à associer lesdits identifiants uniques à un substrat de collage de pastilles et aux pastilles ou boîtiers résultants empilés à l'échelle d'une puce. Les identifiants uniques de pastilles sont également associés à des numéros de tranches, à des positions en x-y sur une tranche, à des numéros de lots de tranches ou à une combinaison quelconque de ceux-ci.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)