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Machine translation
1. (WO2011139349) COMPOSITIONS FOR LINKING ZINC FINGER MODULES
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2011/139349    International Application No.:    PCT/US2011/000758
Publication Date: 10.11.2011 International Filing Date: 02.05.2011
IPC:
C12P 21/06 (2006.01), C07H 21/04 (2006.01), A61K 38/04 (2006.01), C12N 5/00 (2006.01)
Applicants: SANGAMO BIOSCIENCES, INC. [US/US]; Point Richmond Tech Center 501 Canal Blvd., Suite A100 Richmond, California 94804 (US) (For All Designated States Except US).
PASCHON, David [US/US]; (US) (For US Only).
REBAR, Edward J. [US/US]; (US) (For US Only)
Inventors: PASCHON, David; (US).
REBAR, Edward J.; (US)
Agent: PASTERNAK, Dahna, S.; Pasternak Patent Law 1900 Embarcadero Rd. Suite 211 Palo Alto, CA 94303 (US)
Priority Data:
61/343,729 03.05.2010 US
Title (EN) COMPOSITIONS FOR LINKING ZINC FINGER MODULES
(FR) COMPOSITIONS POUR RELIER DES MODULES EN DOIGT DE ZINC
Abstract: front page image
(EN)Disclosed herein are compositions for linking DNA binding modules to allow for specific and selective binding to module subsites separated by 1 or more base pairs. Also described are methods of making and using compositions comprising these linkers.
(FR)L'invention concerne des compositions pour relier des modules liant l'ADN afin de permettre la liaison spécifique et sélective à des sous-sites du module séparés d'une ou plusieurs paires de bases. Elle concerne également des procédés de préparation et d'utilisation de compositions comprenant ces lieurs.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)