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Machine translation
1. (WO2011139231) BONDING STRESS TESTING ARRANGEMENT AND METHOD OF DETERMINING STRESS
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2011/139231    International Application No.:    PCT/SG2011/000168
Publication Date: 10.11.2011 International Filing Date: 03.05.2011
Chapter 2 Demand Filed:    07.12.2011    
IPC:
G01L 1/18 (2006.01), H01L 21/66 (2006.01)
Applicants: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH [SG/SG]; 1 Fusionopolis Way #20-10 Connexis Singapore 138632 (SG) (For All Designated States Except US).
SELVANAYAGAM, Cheryl Sharmani [SG/SG]; (SG) (For US Only).
ZHANG, Xiaowu [SG/SG]; (SG) (For US Only).
CHAI, Tai Chong [MY/SG]; (SG) (For US Only).
TRIGG, Alastair David [GB/SG]; (SG) (For US Only).
CHENG, Cheng Kuo [SG/SG]; (SG) (For US Only).
CHEN, Xian Tong [CN/SG]; (SG) (For US Only).
VAIDYANATHAN, Kripesh [SG/SG]; (SG) (For US Only)
Inventors: SELVANAYAGAM, Cheryl Sharmani; (SG).
ZHANG, Xiaowu; (SG).
CHAI, Tai Chong; (SG).
TRIGG, Alastair David; (SG).
CHENG, Cheng Kuo; (SG).
CHEN, Xian Tong; (SG).
VAIDYANATHAN, Kripesh; (SG)
Agent: VIERING, JENTSCHURA & PARTNER LLP; P.O. Box 1088 Rochor Post Office Rochor Road Singapore 911833 (SG)
Priority Data:
201003260-5 07.05.2010 SG
Title (EN) BONDING STRESS TESTING ARRANGEMENT AND METHOD OF DETERMINING STRESS
(FR) DISPOSITIF DE TEST DE CONTRAINTE DE CONNEXION ET PROCÉDÉ DE DÉTERMINATION DE CONTRAINTE
Abstract: front page image
(EN)A bonding stress testing arrangement and a method of determining stress are provided. The bonding stress testing arrangement includes at least one bond pad; a sensor assembly comprising any one of a first sensor arrangement, a second sensor arrangement and a combination of the first sensor arrangement and the second sensor arrangement; wherein the first sensor arrangement is adapted to measure an average stress on a portion of a bonding area under the at least one bond pad, and the second sensor arrangement is adapted to determine stress distribution over a portion or an entire of the bonding area under the at least one bond pad.
(FR)L'invention concerne un dispositif de test de contraintes de connexion et un procédé de détermination de contrainte. Le dispositif de test de contrainte de connexion comprend au moins un plot de connexion ; un ensemble capteur comprenant l'une quelconque d'une première configuration de capteurs, d'une seconde configuration de capteurs et d'une combinaison de la première configuration de capteurs et de la seconde configuration de capteurs ; la première configuration de capteurs étant apte à mesurer une contrainte moyenne sur une partie d'une zone de connexion se trouvant en dessous de l'au moins un plot de connexion, et la seconde configuration de capteurs étant apte à déterminer la répartition de la contrainte dans une partie ou dans la totalité de la zone de connexion située en dessous de l'au moins un plot de connexion.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)