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Machine translation
1. (WO2011137298) IMPROVED BIOCOMPATIBLE BONDING METHOD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2011/137298    International Application No.:    PCT/US2011/034471
Publication Date: 03.11.2011 International Filing Date: 29.04.2011
IPC:
A61N 1/36 (2006.01), A61N 1/375 (2006.01), H01L 21/60 (2006.01), H01L 21/56 (2006.01), A61B 5/04 (2006.01)
Applicants: SECOND SIGHT MEDICAL PRODUCTS,INC. [US/US]; 12744 San Fernando Road, Building 3 Sylmar, CA 91342 (US) (For All Designated States Except US).
FARAJI, Boozarjomehr [US/US]; (US) (For US Only).
ZHOU, David, Daomin [US/US]; (US) (For US Only).
GREENBERG, Robert, J. [US/US]; (US) (For US Only).
OK, Jerry [US/US]; (US) (For US Only).
TALBOT, Neil, Hamilton [AU/US]; (US) (For US Only).
LITTLE, James, Singleton [US/US]; (US) (For US Only)
Inventors: FARAJI, Boozarjomehr; (US).
ZHOU, David, Daomin; (US).
GREENBERG, Robert, J.; (US).
OK, Jerry; (US).
TALBOT, Neil, Hamilton; (US).
LITTLE, James, Singleton; (US)
Agent: DUNBAR, Scott; Second Sight Medical Products, Inc. 12744 San Fernando Road, Building 3 Sylmar, CA 91342 (US)
Priority Data:
61/330,204 30.04.2010 US
61/330,089 30.04.2010 US
Title (EN) IMPROVED BIOCOMPATIBLE BONDING METHOD
(FR) PROCÉDÉ AMÉLIORÉ DE LIAISON BIOCOMPATIBLE
Abstract: front page image
(EN)The invention is a device and method for connecting a hermetic package to a flexible circuit such as for an electrode array in an implantable device. Attaching metal pads on a flexible circuit to metal pads on a hermetic device by conductive adhesive is known. A smooth metal, such as platinum, does not bond well to conductive epoxy. The invention provides a roughened surface, such as by etching or by applying high surface area platinum gray, to improve adhesion to platinum or other metal pads.
(FR)L'invention concerne un dispositif et un procédé de connexion d'un emballage hermétique à un circuit flexible, par exemple pour un ensemble d'électrodes dans un dispositif implantable. L'attache de plaques métalliques d'un circuit flexible à des plaques métalliques d'un dispositif hermétique au moyen d'un adhésif conducteur est connue. Un métal lisse, tel que le platine, ne se lie pas correctement à l'époxy conducteur. L'invention apporte une surface rendue rugueuse, par exemple par gravure ou application d'un gris de platine à surface active élevée pour améliorer l'adhérence aux plaques de platine ou d'autres métaux.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)