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Machine translation
1. (WO2011136594) COPPER AND TITANIUM COMPOSITION FOR METAL LAYER ETCHING SOLUTION
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2011/136594    International Application No.:    PCT/KR2011/003172
Publication Date: 03.11.2011 International Filing Date: 28.04.2011
IPC:
C23F 1/18 (2006.01), C23F 1/30 (2006.01), H01L 21/205 (2006.01)
Applicants: DONGWOO FINE-CHEM CO., LTD. [KR/KR]; 740-30, Sinheung-dong, Iksan-si, Jeollabuk-do 570-140 (KR) (For All Designated States Except US).
LIM, Min-Ki [KR/KR]; (KR) (For US Only).
KWON, O-Byoung [KR/KR]; (KR) (For US Only).
LEE, Yu-Jin [KR/KR]; (KR) (For US Only).
YU, In-Ho [KR/KR]; (KR) (For US Only)
Inventors: LIM, Min-Ki; (KR).
KWON, O-Byoung; (KR).
LEE, Yu-Jin; (KR).
YU, In-Ho; (KR)
Agent: HAN YANG PATENT FIRM; Hanyang Building 412-1 Dogok-dong, Gangnam-gu Seoul 135-854 (KR)
Priority Data:
10-2010-0040568 30.04.2010 KR
Title (EN) COPPER AND TITANIUM COMPOSITION FOR METAL LAYER ETCHING SOLUTION
(FR) COMPOSITION DE CUIVRE ET DE TITANE POUR SOLUTION DE GRAVURE DE COUCHE MÉTALLIQUE
(KO) 구리와 티타늄을 포함하는 금속막용 식각액 조성물
Abstract: front page image
(EN)The present invention relates to a copper and titanium composition for a metal layer etching solution comprising the following, based on the total weight of the composition: 5 to 20 wt % of persulfate; 0.01 to 2 wt % of a fluorine compound; 1-10 wt % of an additive containing one or more acids selected from inorganic acids, salts of inorganic acids, and a mixture thereof; 0.3 to 5 wt % of a cyclic amine compound; 0.1 to 5 wt % of a chlorine compound; 0.1 to 5 wt % of a p-toluene sulfonic acid; and with the remainder being water.
(FR)La présente invention porte sur une composition de cuivre et de titane pour une solution de gravure de couche métallique comprenant les composants suivants, sur la base du poids total de la composition : 5 à 20 % en poids de persulfate ; 0,01 à 2 % en poids d'un composé du fluor ; 1-10 % en poids d'un additif contenant un ou plusieurs acides choisis parmi les acides inorganiques, les sels d'acides inorganiques et les mélanges de ceux-ci ; 0,3 à 5 % en poids d'un composé amine cyclique ; 0,1 à 5 % en poids d'un composé du chlore ; 0,1 à 5 % en poids d'un acide p-toluènesulfonique ; le reste étant de l'eau.
(KO)본 발명은 조성물 총 중량에 대하여, 과황산염 5~20 중량%; 함불소화합물 0.01~2 중량%; 무기산, 무기산염 및 이들의 혼합물 중에서 선택되는 1종 이상 1~10 중량%; 고리형 아민화합물 0.3~5 중량%; 함염소화합물 0.1~5 중량%; p-톨루엔 술폰산(p-toluene sulfonic acid) 0.1~5 중량%; 및 물 잔량을 포함하는 것을 특징으로 하는 구리와 티타늄을 포함하는 금속막용 식각액 조성물에 관한 것이다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)