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Machine translation
1. (WO2011136003) SWITCHING CIRCUIT
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2011/136003    International Application No.:    PCT/JP2011/058913
Publication Date: 03.11.2011 International Filing Date: 08.04.2011
IPC:
H02M 7/5387 (2007.01)
Applicants: HONDA MOTOR CO., LTD. [JP/JP]; 1-1, Minami-Aoyama 2-chome, Minato-ku, Tokyo 1078556 (JP) (For All Designated States Except US).
SEKI Shinsei [JP/JP]; (JP) (For US Only).
SHINOHARA Sadao [JP/JP]; (JP) (For US Only)
Inventors: SEKI Shinsei; (JP).
SHINOHARA Sadao; (JP)
Agent: SHIGA Masatake; 1-9-2, Marunouchi, Chiyoda-ku, Tokyo 1006620 (JP)
Priority Data:
2010-103840 28.04.2010 JP
Title (EN) SWITCHING CIRCUIT
(FR) CIRCUIT DE COMMUTATION
(JA) スイッチング回路
Abstract: front page image
(EN)Disclosed is a switching circuit having an arm wherein two switching elements (10a, 10b) are connected thereto, and reverse conduction elements (14a, 14b) are connected in parallel to the switching elements, respectively. The switching elements are formed of a SiC semiconductor, and when a commutation current flows in the reverse conduction element, the switching element having such reverse conduction element connected thereto in parallel is turned on.
(FR)L'invention concerne un circuit de commutation comportant un bras, dans lequel deux éléments de commutation (10a, 10b) sont connectés à celui-ci et des éléments de conduction inverses (14a, 14b) sont respectivement connectés en parallèle aux éléments de commutation. Les éléments de commutation sont constitués d'un semiconducteur de SiC et, lorsqu'un courant de commutation passe dans l'élément de conduction inverse, l'élément de commutation comportant cet élément de conduction inverse connecté à celui-ci en parallèle, est rendu passant.
(JA)2つのスイッチング素子(10a、10b)が接続され、各スイッチング素子に並列に逆導通素子(14a、14b)が接続されたアームを有するスイッチング回路であって、前記スイッチング素子はSiC半導体であり;前記逆導通素子に転流電流が流れる際に、この逆導通素子が並列接続された前記スイッチング素子をON作動させる。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)