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Machine translation
1. (WO2011135926) SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT, AND COMPOSITE MODULE
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2011/135926    International Application No.:    PCT/JP2011/055203
Publication Date: 03.11.2011 International Filing Date: 07.03.2011
IPC:
H05K 3/46 (2006.01)
Applicants: MURATA MANUFACTURING CO., LTD. [JP/JP]; 10-1, Higashikotari 1-chome, Nagaokakyo-shi, Kyoto 6178555 (JP) (For All Designated States Except US).
OGAWA, Nobuaki [JP/JP]; (JP) (For US Only).
SAKAI, Norio [JP/JP]; (JP) (For US Only)
Inventors: OGAWA, Nobuaki; (JP).
SAKAI, Norio; (JP)
Priority Data:
2010-102314 27.04.2010 JP
Title (EN) SUBSTRATE WITH BUILT-IN ELECTRONIC COMPONENT, AND COMPOSITE MODULE
(FR) SUBSTRAT AVEC COMPOSANT ÉLECTRONIQUE INTÉGRÉ ET MODULE COMPOSITE
(JA) 電子部品内蔵基板、および複合モジュール
Abstract: front page image
(EN)Disclosed is a substrate (100) with a built-in electronic component, within which solder flashing does not easily occur even in cases where heat is applied thereto when the substrate is mounted on another substrate. The substrate (100) with a built-in electronic component comprises: a core substrate (1); electrodes (4, 5) respectively formed on one main surface and the other main surface of the core substrate (1); an electronic component (6) that is mounted on the electrode (4), which is formed on the main surface of the core substrate (1); and a resin layer (9) that is formed on the main surface of the core substrate (1) so as to cover the electronic component. The surface of the electrode (4), which is formed on the main surface of the core substrate (1), is not plated.
(FR)L'invention concerne un substrat (100) comprenant un composant électronique intégré à l'intérieur duquel il ne se produit pas facilement d'évaporation éclair de la soudure dans le cas où de la chaleur est appliquée, lorsque le substrat est monté sur un autre substrat. Le substrat (100) avec composant électronique intégré comprend un substrat de cœur (1) ; des électrodes (4, 5) respectivement formées sur une surface principale et sur l'autre surface principale du substrat de cœur (1) ; un composant électronique (6) monté sur l'électrode (4) formée sur la surface principale du substrat de cœur (1) ; et une couche de résine (9) formée sur la surface principale du substrat de cœur (1) afin de recouvrir le composant électronique. La surface de l'électrode (4) formée sur la surface principale du substrat de cœur (1) n'est pas métallisée.
(JA) 別の基板に実装する際などに熱が加えられても、内部においてはんだフラッシュ現象が起こりにくい電子部品内蔵基板100を提供する。 本発明の電子部品内蔵基板100は、コア基板1と、コア基板1の一方および他方の主面にそれぞれ形成された電極4、5と、コア基板1の一方の主面に形成された電極4に実装された電子部品6と、コア基板1の一方の主面に電子部品を覆って形成された樹脂層9とを備え、コア基板1の一方の主面に形成された電極4の表面には、めっきを施さないようにした。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, RS, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)