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1. WO2011130923 - PREPARATION METHOD FOR COPPER OXIDE NANOWIRES

Publication Number WO/2011/130923
Publication Date 27.10.2011
International Application No. PCT/CN2010/072156
International Filing Date 23.04.2010
IPC
C01G 3/02 2006.1
CCHEMISTRY; METALLURGY
01INORGANIC CHEMISTRY
GCOMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F94
3Compounds of copper
02Oxides; Hydroxides
B82B 3/00 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
82NANOTECHNOLOGY
BNANOSTRUCTURES FORMED BY MANIPULATION OF INDIVIDUAL ATOMS, MOLECULES, OR LIMITED COLLECTIONS OF ATOMS OR MOLECULES AS DISCRETE UNITS; MANUFACTURE OR TREATMENT THEREOF
3Manufacture or treatment of nanostructures by manipulation of individual atoms or molecules, or limited collections of atoms or molecules as discrete units
C23C 14/00 2006.1
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
H01J 1/30 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
1Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
02Main electrodes
30Cold cathodes
CPC
B05D 5/12
BPERFORMING OPERATIONS; TRANSPORTING
05SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
DPROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
5Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
12to obtain a coating with specific electrical properties
B82Y 30/00
BPERFORMING OPERATIONS; TRANSPORTING
82NANOTECHNOLOGY
YSPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
30Nanotechnology for materials or surface science, e.g. nanocomposites
C01G 3/02
CCHEMISTRY; METALLURGY
01INORGANIC CHEMISTRY
GCOMPOUNDS CONTAINING METALS NOT COVERED BY SUBCLASSES C01D OR C01F
3Compounds of copper
02Oxides; Hydroxides
C01P 2004/16
CCHEMISTRY; METALLURGY
01INORGANIC CHEMISTRY
PINDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
2004Particle morphology
10extending in one dimension, e.g. needle-like
16Nanowires or nanorods, i.e. solid nanofibres with two nearly equal dimensions between 1-100 nanometer
C23C 18/06
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
18Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
02by thermal decomposition
06Coating on selected surface areas, e.g. using masks
H01J 1/304
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
1Details of electrodes, of magnetic control means, of screens, or of the mounting or spacing thereof, common to two or more basic types of discharge tubes or lamps
02Main electrodes
30Cold cathodes, e.g. field-emissive cathode
304Field-emissive cathodes
Applicants
  • 海洋王照明科技股份有限公司 OCEAN'S KING LIGHTING SCIENCE & TECHNOLOGY CO., LTD. [CN]/[CN] (AllExceptUS)
  • 周明杰 ZHOU, Mingjie [CN]/[CN] (UsOnly)
  • 邵鹏睿 SHAO, Pengrui [CN]/[CN] (UsOnly)
  • 马文波 MA, Wenbo [CN]/[CN] (UsOnly)
Inventors
  • 周明杰 ZHOU, Mingjie
  • 邵鹏睿 SHAO, Pengrui
  • 马文波 MA, Wenbo
Agents
  • 深圳中一专利商标事务所 SHENZHEN ZHONGYI PATENT AND TRADEMARK OFFICE
Priority Data
Publication Language Chinese (zh)
Filing Language Chinese (ZH)
Designated States
Title
(EN) PREPARATION METHOD FOR COPPER OXIDE NANOWIRES
(FR) PROCÉDÉ DE PRÉPARATION POUR DES NANOFILS D'OXYDE DE CUIVRE
(ZH) 氧化铜纳米线的制备方法
Abstract
(EN) A preparation method for copper oxide nanowires includes the following steps: step 1, preparing a conductive layer as an electrode on a clean substrate, or directly using a clean substrate with a conductive layer; step 2, weighing up copper powder, then homogeneously mixing the copper powder with organic carrier; step 3, printing the mixture prepared in step 2 onto the clean substrate with a conductive layer by means of a screen printing method; step 4, sintering the substrate after the process of step 3 under atmosphere which contains oxygen gas, and finally obtaining the copper oxide nanowires after a cooling process.
(FR) L'invention porte sur un procédé de préparation pour des nanofils d'oxyde de cuivre comprenant les étapes suivantes : étape 1, la préparation d'une couche conductrice servant d'électrode sur un substrat propre, ou l'utilisation directe d'un substrat propre doté d'une couche conductrice ; étape 2, le pesage de poudre de cuivre, puis le mélange homogène de la poudre de cuivre avec un véhicule organique ; étape 3, l'impression du mélange préparé dans l'étape 2 sur le substrat propre doté d'une couche conductrice au moyen d'un procédé de sérigraphie ; étape 4, le frittage du substrat après le processus de l'étape 3 sous une atmosphère qui contient de l'oxygène gazeux et enfin l'obtention des nanofils d'oxyde de cuivre après un processus de refroidissement.
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