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1. WO2011127867 - MULTI-LAYER CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

Publication Number WO/2011/127867
Publication Date 20.10.2011
International Application No. PCT/CN2011/074807
International Filing Date 27.05.2011
IPC
H05K 1/02 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
H05K 3/46 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multi-layer circuits
CPC
H05K 1/0266
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0266Marks, test patterns or identification means
H05K 1/0298
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0296Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
0298Multilayer circuits
H05K 2201/09781
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
09654covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
09781Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
H05K 2201/09936
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09818Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
09936Marks, inscriptions, etc. for information
H05K 3/4611
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multilayer circuits
4611by laminating two or more circuit boards
H05K 3/4638
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
46Manufacturing multilayer circuits
4611by laminating two or more circuit boards
4638Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
Applicants
  • 华为技术有限公司 HUAWEI TECHNOLOGIES CO., LTD. [CN]/[CN] (AllExceptUS)
  • 丁丽 DING, Li [CN]/[CN] (UsOnly)
Inventors
  • 丁丽 DING, Li
Priority Data
Publication Language Chinese (zh)
Filing Language Chinese (ZH)
Designated States
Title
(EN) MULTI-LAYER CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
(FR) CARTE À CIRCUIT IMPRIMÉ MULTICOUCHE ET SON PROCÉDÉ DE FABRICATION
(ZH) 一种多层电路板及其制造方法
Abstract
(EN) A multi-layer circuit board is provided. The multi-layer circuit board comprises: a plurality of core boards (1) laminated together, the core board (1) comprises an insulating layer and at least one conductive layer attached together, the conductive layer comprises a circuit, the core board (1) has at least one identification conductor (11) disposed on the edge of the at least one conductive layer, the identification conductor (11) forms an identification pattern on a side surface of the core board (1) along a core boards lamination direction, and the identification patterns of the plurality of core boards (1) are different from each other on the side surface of the multi-layer circuit board along the core boards lamination direction. A method of manufacturing the multi-layer circuit board is also provided.
(FR) Fait l'objet de cette invention une carte à circuit imprimé multicouche comprenant: une pluralité de couches noyaux empilées (1), lesquelles couches (1) comprennent une couche isolante et au moins une couche conductrice qui sont fixées ensemble, la couche conductrice comprenant un circuit, des couches noyaux présentant au moins un conducteur d'identification (11) disposé sur le bord d'au moins une couche conductrice, le conducteur d'identification (11) formant un motif d'identification sur une surface latérale de la couche noyau (1) le long de la couche à noyau feuilleté. Les motifs d'identification de la pluralité de couches noyaux (1) sont différents les uns des autres sur la surface latérale de la carte à circuit imprimé multicouche le long de la couche à noyau feuilleté. Fait aussi l'objet de cette invention une carte à circuit imprimé multicouche.
(ZH) 提供了一种多层电路板。所述多层电路板包括:堆叠在一起的多个芯板(1),所述芯板(1)包括贴置在一起的绝缘层和至少一层导体层,所述导体层包括电路,所述芯板(1)在至少一层导体层的边缘设置有至少一个标识导体(11),所述标识导体(11)在所述芯板(1)沿着芯板堆叠方向的侧面形成标识图形,所述多个芯板(1)的标识图形在所述多层电路板沿着芯板堆叠方向的侧面上各不相同。还提供了一种多层电路板的制作方法。
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