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1. WO2011123673 - IMPROVED METHOD AND APPARATUS FOR LASER SINGULATION OF BRITTLE MATERIALS

Publication Number WO/2011/123673
Publication Date 06.10.2011
International Application No. PCT/US2011/030768
International Filing Date 31.03.2011
IPC
H01L 21/301 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
301to subdivide a semiconductor body into separate parts, e.g. making partitions
H01L 21/78 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
78with subsequent division of the substrate into plural individual devices
CPC
B23K 2103/50
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2103Materials to be soldered, welded or cut
50Inorganic material, e.g. metals, not provided for in B23K2103/02B23K2103/26
B23K 2103/56
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2103Materials to be soldered, welded or cut
50Inorganic material, e.g. metals, not provided for in B23K2103/02B23K2103/26
56semiconducting
B23K 26/0006
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
0006taking account of the properties of the material involved
B23K 26/0626
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06Shaping the laser beam, e.g. by masks or multi-focusing
062by direct control of the laser beam
0626Energy control of the laser beam
B23K 26/38
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
38by boring or cutting
B23K 26/40
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
36Removing material
40taking account of the properties of the material involved
Applicants
  • ELECTRO SCIENTIFIC INDUSTRIES, INC. [US]/[US] (AllExceptUS)
  • OSAKO, Yasu [JP]/[US] (UsOnly)
  • FINN, Daragh [IE]/[US] (UsOnly)
Inventors
  • OSAKO, Yasu
  • FINN, Daragh
Agents
  • LEONARD, Patrick
Priority Data
12/753,36702.04.2010US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) IMPROVED METHOD AND APPARATUS FOR LASER SINGULATION OF BRITTLE MATERIALS
(FR) MÉTHODE ET APPAREIL AMÉLIORÉS DE SINGULARISATION LASER DE MATÉRIAUX CASSANTS
Abstract
(EN) An improved method for singulation of electronic substrates 60 into dice uses a laser 70 to first form cuts 62 in the substrate 60 and then chamfers 66, 67 the edges 63 of the cuts 62 by altering the laser parameters. The chamfers 66, 67 increase die break strength by reducing the residual damage and removes debris caused by the initial laser cut 62 without requiring additional process steps, additional equipment or consumable supplies.
(FR) L'invention concerne une méthode améliorée de singularisation de substrats électroniques 60 en dés à l'aide d'un laser 70 pour premièrement former des découpes 62 dans le substrat 60 puis chanfreiner 66, 67 les rebords 63 des découpes 62 en modifiant les paramètres du laser. Les chanfreins 66, 67 augmentent la résistance à la rupture des dés en réduisant les dommages résiduels et éliminent les débris créés par la découpe laser initiale 62 sans nécessiter d'étapes de procédé supplémentaires, d'équipement supplémentaire ou de consommables.
Latest bibliographic data on file with the International Bureau