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1. WO2011123288 - GROOVED STRUCTURE FOR DIE-MOUNT AND MEDIA SEALING

Publication Number WO/2011/123288
Publication Date 06.10.2011
International Application No. PCT/US2011/029405
International Filing Date 22.03.2011
IPC
G01L 9/00 2006.1
GPHYSICS
01MEASURING; TESTING
LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
9Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
CPC
G01L 19/147
GPHYSICS
01MEASURING; TESTING
LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
19Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
14Housings
147Details about the mounting of the sensor to support or covering means
G01L 9/0052
GPHYSICS
01MEASURING; TESTING
LMEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
9Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements
0041Transmitting or indicating the displacement of flexible diaphragms
0051using variations in ohmic resistance
0052of piezoresistive elements
H01L 2224/48137
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
48137the bodies being arranged next to each other, e.g. on a common substrate
Applicants
  • CONTINENTAL AUTOMOTIVE SYSTEMS, INC. [US]/[US] (AllExceptUS)
  • CHIOU, Jen-Huang Albert [US]/[US] (UsOnly)
  • CHEN, Shiuh-Hui Steven [US]/[US] (UsOnly)
Inventors
  • CHIOU, Jen-Huang Albert
  • CHEN, Shiuh-Hui Steven
Agents
  • KLEIN, William
Priority Data
12/748,73929.03.2010US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) GROOVED STRUCTURE FOR DIE-MOUNT AND MEDIA SEALING
(FR) STRUCTURE RAINURÉE POUR MONTAGE DE PUCE ET SCELLEMENT HERMÉTIQUE DE MILIEU
Abstract
(EN) Dual piezoresistive transducers formed into a single silicon die, are anodically bonded to a pedestal. Two separate pressure ports extend through a plastic housing. The port openings inside the housing are surrounded by a groove having a shape and size that accepts the pedestal. A thin, liquid adhesive is deposited into the groove and allowed to level out. The pedestal is placed into the adhesive and embeds itself therein. Adhesive overflow into the ports is avoided by dimensioning the groove and depositing an amount of adhesive that will fill the groove but not overflow when the pedestal is placed therein. Once the adhesive cures, the adhesive bond strength is greater due to the adhesive being in shear relative to the groove side walls and pedestal sidewalls. The grooved structure provides an apparatus and methodology for precise die mounting and media sealing.
(FR) Selon l'invention, des transducteurs piézo-résistants doubles formés sur une puce de silicium unique sont fixés de façon anodique à un socle. Deux orifices de pression séparés s'étendent à travers un boîtier en matière plastique. Les ouvertures d'orifice à l'intérieur du boîtier sont entourées par une rainure ayant une forme et une taille qui accepte le socle. Un adhésif liquide fin est déposé dans la rainure et il est laissé se mettre à niveau. Le socle est disposé dans l'adhésif et s'incorpore à l'intérieur de celui-ci. Un débordement d'adhésif dans les orifices est évité par le dimensionnement de la rainure et la déposition d'une quantité d'adhésif qui remplira la rainure mais sans déborder lorsque le socle est disposé à l'intérieur de celui-ci. Une fois que l'adhésif durcit, la force de liaison de l'adhésif est plus élevée du fait que l'adhésif est en cisaillement par rapport aux parois latérales de la rainure et aux parois latérales du socle. La structure rainurée procure un appareil et une méthodologie pour un montage de puce et un scellement hermétique de milieu précis.
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