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1. WO2011122440 - LASER DEVICE AND METHOD FOR MANUFACTURING SAME

Publication Number WO/2011/122440
Publication Date 06.10.2011
International Application No. PCT/JP2011/057181
International Filing Date 24.03.2011
IPC
G02B 6/42 2006.1
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
24Coupling light guides
42Coupling light guides with opto-electronic elements
H01S 5/022 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
CPC
G02B 6/262
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
26Optical coupling means
262Optical details of coupling light into, or out of, or between fibre ends, e.g. special fibre end shapes or associated optical elements
G02B 6/4206
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
42Coupling light guides with opto-electronic elements
4201Packages, e.g. shape, construction, internal or external details
4204the coupling comprising intermediate optical elements, e.g. lenses, holograms
4206Optical features
G02B 6/4296
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
42Coupling light guides with opto-electronic elements
4296coupling with sources of high radiant energy, e.g. high power lasers, high temperature light sources
H01S 5/02251
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
0225Out-coupling of light
02251using optical fibres
H01S 5/02326
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
022Mountings; Housings
023Mount members, e.g. sub-mount members
02325Mechanically integrated components on mount members or optical micro-benches
02326Arrangements for relative positioning of laser diodes and optical components, e.g. grooves in the mount to fix optical fibres or lenses
H01S 5/02438
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
5Semiconductor lasers
02Structural details or components not essential to laser action
024Arrangements for thermal management
02438Characterized by cooling of elements other than the laser chip, e.g. an optical element being part of an external cavity or a collimating lens
Applicants
  • 株式会社フジクラ Fujikura Ltd. [JP]/[JP] (AllExceptUS)
  • 豊原 望 TOYOHARA, Nozomu (UsOnly)
  • 坂元 明 SAKAMOTO, Akira (UsOnly)
  • 葛西 洋平 KASAI, Yohei (UsOnly)
Inventors
  • 豊原 望 TOYOHARA, Nozomu
  • 坂元 明 SAKAMOTO, Akira
  • 葛西 洋平 KASAI, Yohei
Agents
  • 特許業務法人原謙三国際特許事務所 HARAKENZO WORLD PATENT & TRADEMARK
Priority Data
2010-07896730.03.2010JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) LASER DEVICE AND METHOD FOR MANUFACTURING SAME
(FR) DISPOSITIF DE LASER ET SON PROCÉDÉ DE FABRICATION
(JA) レーザ装置およびその製造方法
Abstract
(EN) Disclosed is a laser device (100) which is provided with: a semiconductor laser element (2) having an output surface (2a), from which a laser beam is outputted; an optical fiber (4) having a leading end portion (4a) disposed to face the output surface (2a) of the semiconductor laser element (2); and an optical fiber supporting member (5) composed of a non heat insulating material, said optical fiber supporting member having a bonding pad (7) that fixes the optical fiber (4) using a solder (8), and supporting the optical fiber (4). The optical fiber supporting member (5) includes a contact portion, which is thermally in contact with a base (1), and the bonding pad (7) is disposed at a distance from the contact portion at the time of fixing the optical fiber (4) to the bonding pad (7) such that the bonding pad is positioned on the reverse side of the contact portion by having, between the bonding pad and the contact portion, a region to be irradiated with a laser beam emitted from a laser element different from the semiconductor laser element (2), and the bonding pad is spatially separated from the base (1).
(FR) L'invention porte sur un dispositif de laser (100), qui comporte : un élément de laser à semi-conducteurs (2) comportant une surface de sortie (2a) à partir de laquelle un faisceau de laser est délivré en sortie ; une fibre optique (4) comportant une partie d'extrémité avant (4a) disposée de façon à faire face à la surface de sortie (2a) de l'élément de laser à semi-conducteurs (2) ; et un élément de support de fibre optique (5) constitué par un matériau non isolant thermiquement, ledit élément de support de fibre optique comportant une zone de fixation (7) qui fixe la fibre optique (4) à l'aide d'une soudure (8), et supportant la fibre optique (4). L'élément de support de fibre optique (5) comprend une partie de contact, qui est en contact thermique avec une base (1), et la zone de fixation (7) est disposée à une certaine distance de la partie de contact au moment de la fixation de la fibre optique (4) à la zone de fixation (7), de telle sorte que la zone de fixation est positionnée sur le côté inverse de la partie de contact par le fait d'avoir, entre la zone de fixation et la partie de contact, une région destinée à être irradiée par un faisceau de laser émis par un élément de laser différent de l'élément de laser à semi-conducteurs (2), et que la zone de fixation est spatialement séparée de la base (1).
(JA)  本発明のレーザ装置(100)は、レーザ光を出射する出射面(2a)を有する半導体レーザ素子(2)と、半導体レーザ素子(2)の出射面(2a)に対向するように配置された先端部(4a)を有する光ファイバ(4)と、光ファイバ(4)を半田(8)により固定する接合パッド(7)を有し、光ファイバ(4)を支持する、非断熱材料からなる光ファイバ支持部材(5)とを備えている。光ファイバ支持部材(5)は、台座(1)に熱的に接触する接触部位を含み、接合パッド(7)は、光ファイバ(4)を接合パッド(7)に固定する際に半導体レーザ素子(2)とは異なるレーザ素子からレーザ光照射される領域を挟んで接触部位と反対側に位置するように接触部位から離間しており、且つ、台座(1)と空間的に分離されている。
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