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1. WO2011121819 - LOOP HEAT PIPE

Publication Number WO/2011/121819
Publication Date 06.10.2011
International Application No. PCT/JP2010/066329
International Filing Date 21.09.2010
IPC
F28D 15/02 2006.1
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT; HEAT STORAGE PLANTS OR APPARATUS IN GENERAL
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls
02in which the medium condenses and evaporates, e.g. heat-pipes
CPC
F28D 15/0266
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
02in which the medium condenses and evaporates, e.g. heat pipes
0266with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
F28D 15/046
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
15Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
02in which the medium condenses and evaporates, e.g. heat pipes
04with tubes having a capillary structure
046characterised by the material or the construction of the capillary structure
F28D 2021/0028
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
21Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
0019Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
0028for cooling heat generating elements, e.g. for cooling electronic components or electric devices
F28F 2265/12
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
28HEAT EXCHANGE IN GENERAL
FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
2265Safety or protection arrangements; Arrangements for preventing malfunction
12for preventing overpressure
H01L 23/427
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
427Cooling by change of state, e.g. use of heat pipes
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Applicants
  • 富士通株式会社 FUJITSU LIMITED [JP]/[JP] (AllExceptUS)
  • 内田 浩基 UCHIDA, Hiroki [JP]/[JP] (UsOnly)
  • 塩賀 健司 SHIOGA, Takeshi [JP]/[JP] (UsOnly)
  • 青木 重憲 AOKI, Shigenori [JP]/[JP] (UsOnly)
  • 尾形 晋 OGATA, Susumu [JP]/[JP] (UsOnly)
  • 長岡 秀明 NAGAOKA, Hideaki [JP]/[JP] (UsOnly)
Inventors
  • 内田 浩基 UCHIDA, Hiroki
  • 塩賀 健司 SHIOGA, Takeshi
  • 青木 重憲 AOKI, Shigenori
  • 尾形 晋 OGATA, Susumu
  • 長岡 秀明 NAGAOKA, Hideaki
Agents
  • 伊東 忠彦 ITOH, Tadahiko
Priority Data
2010-07544329.03.2010JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) LOOP HEAT PIPE
(FR) CALODUC À BOUCLE
(JA) ループ型ヒートパイプ
Abstract
(EN) Disclosed is a loop heat pipe which provides stable cooling performance during operation by maintaining thermal contact between an evaporator case and a wick even when a working fluid is at a high temperature and high pressure. The loop heat pipe includes an evaporator for evaporating the working fluid with heat from a heat-generating element and a condenser for condensing the evaporated working fluid, the evaporator and the condenser being coupled to each other in a loop via a coupling pipe. The evaporator has a first space and a second space. The first space has a contact surface with the heat-generating element and evaporates the working fluid fed through the coupling pipe, and the second space is provided on at least one of those surfaces that define the first space and are other than the contact surface. The evaporator is constructed to have a communication hole in the division wall that separates the first and second spaces from each other, the communication hole communicating between the first space and the second space.
(FR) L'invention porte sur un caloduc à boucle, lequel caloduc permet d'obtenir des performances de refroidissement stables durant le fonctionnement, par le maintien d'un contact thermique entre une enceinte d'évaporateur et une mèche même lorsqu'un fluide de travail est à haute température et à haute pression. Le caloduc à boucle comprend un évaporateur pour évaporer le fluide de travail avec de la chaleur venant d'un élément de génération de chaleur et un condenseur pour condenser le fluide de travail évaporé, l'évaporateur et le condenseur étant couplés l'un à l'autre dans une boucle par l'intermédiaire d'un tuyau de couplage. L'évaporateur comporte un premier espace et un second espace. Le premier espace comporte une surface de contact avec l'élément de génération de chaleur et évapore le fluide de travail délivré par l'intermédiaire du tuyau de couplage, et le second espace est disposé sur au moins l'une des surfaces qui définissent le premier espace et qui sont autres que la surface de contact. L'évaporateur est construit de façon à comporter un trou de communication dans la paroi de division qui sépare les premier et second espaces l'un de l'autre, le trou de communication établissant une communication entre le premier espace et le second espace.
(JA)  ループ型ヒートパイプの作動時に、作動流体が高温・高圧になった場合にも蒸発器ケースとウィックの熱的な密着を維持し安定した冷却性能を実現する。 発熱体からの熱で作動流体を気化させる蒸発器と、気体された作動流体を凝縮させる凝縮器とを連結管でループ状に接続したループ型ヒートパイプにおいて、前記蒸発器は、前記発熱体との接触面を有し前記連結管から供給される前記作動流体を蒸発させる第1空間と、前記第1空間を構成する面のうち、前記接触面以外の少なくとも1つの面に設けられる第2空間とを有し、前記第1空間と第2空間を隔てる隔壁に、前記第1空間と第2空間を連通する連通穴を設けた構成とする。
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