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1. WO2011119007 - HEAT-DISSIPATING TAPE AND METHOD FOR MANUFACTURING SAME

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Publication Number WO/2011/119007
Publication Date 29.09.2011
International Application No. PCT/KR2011/002079
International Filing Date 25.03.2011
IPC
C09J 7/00 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
7Adhesives in the form of films or foils
C09J 9/02 2006.1
CCHEMISTRY; METALLURGY
09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
9Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
02Electrically-conducting adhesives
B32B 15/02 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products essentially comprising metal
02in a form other than a sheet, e.g. wire, particles
H05K 7/20 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
B32B 15/02
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products comprising ; a layer of; metal
02Layer formed of wires, e.g. mesh
B32B 15/08
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products comprising ; a layer of; metal
04comprising metal as the main or only constituent of a layer, ; which is; next to another layer of ; the same or of; a ; different material
08of synthetic resin
B32B 15/18
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products comprising ; a layer of; metal
18comprising iron or steel
B32B 15/20
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products comprising ; a layer of; metal
20comprising aluminium or copper
B32B 2307/30
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2307Properties of the layers or laminate
30having particular thermal properties
B32B 2307/302
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
2307Properties of the layers or laminate
30having particular thermal properties
302Conductive
Applicants
  • 율촌화학 주식회사 YOUL CHON CHEMICAL CO., LTD. [KR]/[KR] (AllExceptUS)
  • 정재철 JUNG, Jae Chul [KR]/[KR] (UsOnly)
  • 강한준 KANG, Han Jun [KR]/[KR] (UsOnly)
  • 이성호 LEE, Sung Ho [KR]/[KR] (UsOnly)
  • 김지희 KIM, Ji Hee [KR]/[KR] (UsOnly)
Inventors
  • 정재철 JUNG, Jae Chul
  • 강한준 KANG, Han Jun
  • 이성호 LEE, Sung Ho
  • 김지희 KIM, Ji Hee
Agents
  • 김순영 KIM, Sun-Young
Priority Data
10-2010-002733526.03.2010KR
Publication Language Korean (ko)
Filing Language Korean (KO)
Designated States
Title
(EN) HEAT-DISSIPATING TAPE AND METHOD FOR MANUFACTURING SAME
(FR) BANDE DE DISSIPATION DE CHALEUR ET PROCÉDÉ DE FABRICATION ASSOCIÉ
(KO) 방열 테이프 및 그 제조 방법
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Abstract
(EN) The present invention relates to a heat-dissipating tape to be used in a variety of electronic products so as to dissipate heat from said electronic products, and to a method for manufacturing the heat-dissipating tape. The heat-dissipating tape of the present invention comprises: a metal mesh base; and a heat-dissipating paint layer, wherein the heat-dissipating paint layer is formed on one side or either side of the metal mesh base. In addition, the heat-dissipating tape of the present invention comprises: a metal mesh base; a heat-dissipating paint layer; and an adhesive layer, wherein the heat dissipating paint layer is formed on one side or either side of the metal mesh base, and the adhesive layer is made of thermally conductive adhesives. The heat-dissipating tape of the present invention is thin, dissipates heat in a vertical direction with respect to a heat-generating source to thereby achieve improved heat-dissipating effects, and has superior adhesion.
(FR) La présente invention concerne une bande de dissipation de chaleur utilisable dans un grand nombre de produits électroniques afin de dissiper la chaleur desdits produits électroniques, et concerne également un procédé de fabrication de la bande de dissipation de chaleur. La bande de dissipation de chaleur de la présente invention comprend : une base constituée de maille métallique ; et une couche de peinture dissipatrice de chaleur, la couche de peinture dissipatrice de chaleur étant formée sur un côté ou sur les deux côtés de la base constituée de maille métallique. En outre, la bande de dissipation de chaleur de la présente invention comprend : une base constituée de maille métallique ; une couche de peinture dissipatrice de chaleur ; et une couche adhésive. La couche de peinture dissipatrice de chaleur est formée sur un côté ou sur les deux côtés de la base constituée de maille métallique. La couche adhésive est constituée d'adhésifs thermiquement conducteurs. La bande de dissipation de chaleur de la présente invention est fine, dissipe la chaleur dans une direction verticale par rapport à une source de génération de chaleur afin d'obtenir des effets améliorés de dissipation de chaleur, et présente une adhésion supérieure.
(KO) 본 발명은 각종 전자제품에 방열을 목적으로 적용되는 방열 테이프 및 그 제조 방법에 관한 것이다. 본 발명은 금속 메쉬 기재; 및 방열 도료층을 포함하는 방열 테이프로서, 상기 방열 도료층은 금속 메쉬 기재의 한 면 또는 양 면에 형성되는 것을 특징으로 하는 방열 테이프 및 그 제조 방법을 제공한다. 또한, 본 발명은 금속 메쉬 기재; 방열 도료층; 및 점착층을 포함하는 방열 테이프로서, 상기 방열 도료층은 금속메쉬 기재의 한 면 또는 양 면에 형성되고, 상기 점착층은 열전도성 점착제로 이루어진 것을 특징으로 하는 방열 테이프 및 그 제조 방법을 제공한다. 본 발명의 방열 테이프는 두께가 얇으면서도 발열원으로부터 수직 방향으로 방열시켜서 방열 효과가 우수하고, 점착력도 우수한 특성을 가진다.
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