Processing

Please wait...

Settings

Settings

Goto Application

1. WO2011111593 - MAGNETIC DEVICE

Publication Number WO/2011/111593
Publication Date 15.09.2011
International Application No. PCT/JP2011/054869
International Filing Date 03.03.2011
IPC
H01L 43/02 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
43Devices using galvano-magnetic or similar magnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof
02Details
H01L 21/8246 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
78with subsequent division of the substrate into plural individual devices
82to produce devices, e.g. integrated circuits, each consisting of a plurality of components
822the substrate being a semiconductor, using silicon technology
8232Field-effect technology
8234MIS technology
8239Memory structures
8246Read-only memory structures (ROM)
H01L 23/00 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
H01L 27/105 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
27Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
02including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
04the substrate being a semiconductor body
10including a plurality of individual components in a repetitive configuration
105including field-effect components
H01L 43/08 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
43Devices using galvano-magnetic or similar magnetic effects; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof
08Magnetic-field-controlled resistors
CPC
H01L 2224/04105
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
02Bonding areas; Manufacturing methods related thereto
04Structure, shape, material or disposition of the bonding areas prior to the connecting process
04105Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
H01L 2224/20
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
18High density interconnect [HDI] connectors; Manufacturing methods related thereto
20Structure, shape, material or disposition of high density interconnect preforms
H01L 23/3128
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
28Encapsulations, e.g. encapsulating layers, coatings, ; e.g. for protection
31characterised by the arrangement ; or shape
3107the device being completely enclosed
3121a substrate forming part of the encapsulation
3128the substrate having spherical bumps for external connection
H01L 23/552
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
552Protection against radiation, e.g. light ; or electromagnetic waves
H01L 24/19
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
24Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
18High density interconnect [HDI] connectors; Manufacturing methods related thereto
19Manufacturing methods of high density interconnect preforms
H01L 2924/01005
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
01Chemical elements
01005Boron [B]
Applicants
  • 日本電気株式会社 NEC CORPORATION [JP]/[JP] (AllExceptUS)
  • 眞子 隆志 MANAKO Takashi [JP]/[JP] (UsOnly)
  • 渡邊 敬仁 WATANABE Takahito [JP]/[JP] (UsOnly)
Inventors
  • 眞子 隆志 MANAKO Takashi
  • 渡邊 敬仁 WATANABE Takahito
Agents
  • 工藤 実 KUDOH Minoru
Priority Data
2010-05362810.03.2010JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) MAGNETIC DEVICE
(FR) DISPOSITIF MAGNÉTIQUE
(JA) 磁性体装置
Abstract
(EN) Disclosed is a magnetic device comprising a substrate, a magnetic element that is mounted on the substrate, an insulator that covers the magnetic element, and a magnetic shield that is formed on the insulator. The magnetic shield comprises an outer shield having a fixed shape and a deformable shield. The deformable shield is composed of a magnetic material that is filled between the outer shield and the insulator. The shape of a magnetic flux guide contained in the deformable shield is variable in accordance with an external magnetic field employed.
(FR) L'invention porte sur un dispositif magnétique comprenant un substrat, un élément magnétique qui est monté sur le substrat, un isolateur qui couvre l'élément magnétique, et un écran magnétique qui est formé sur l'isolateur. L'écran magnétique comprend un écran externe ayant une forme fixe et un écran déformable. L'écran déformable est composé d'un matériau magnétique qui remplit l'espace entre l'écran externe et l'isolateur. La forme d'un guide de flux magnétique contenu dans l'écran déformable est variable en fonction d'un champ magnétique externe employé.
(JA)  磁性体装置は、基板と、基板上に搭載された磁性体素子と、磁性体素子を覆う絶縁体と、絶縁体上に形成された磁気シールドと、を備える。磁気シールドは、形状が固定された外シールドと、可変シールドとを備える。可変シールドは、外シールドと絶縁体との間に充填された磁性体材料で形成される。可変シールド中の磁束ガイドの形状は、外部磁場に応じて可変である。
Related patent documents
Latest bibliographic data on file with the International Bureau