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1. WO2011105693 - OPTICAL INTERCONNECTION METHOD FOR A PLANAR LIGHTWAVE CIRCUIT DEVICE

Publication Number WO/2011/105693
Publication Date 01.09.2011
International Application No. PCT/KR2010/009635
International Filing Date 31.12.2010
IPC
G02B 6/13 2006.1
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
10of the optical waveguide type
12of the integrated circuit kind
13Integrated optical circuits characterised by the manufacturing method
G02B 6/42 2006.1
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
24Coupling light guides
42Coupling light guides with opto-electronic elements
CPC
G02B 6/30
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
6Light guides
24Coupling light guides
26Optical coupling means
30for use between fibre and thin-film device
Applicants
  • 부산대학교 산학협력단 PUSAN NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION [KR]/[KR] (AllExceptUS)
  • 정명영 JEONG, Myung Yung [KR]/[KR] (UsOnly)
  • 김창석 KIM, Chang Seok [KR]/[KR] (UsOnly)
  • 류진화 RYU, Jin Hwa [KR]/[KR] (UsOnly)
  • 오승훈 OH, Seung Hun [KR]/[KR] (UsOnly)
  • 이태호 LEE, Tae Ho [KR]/[KR] (UsOnly)
  • 조상욱 CHO, Sang Uk [KR]/[KR] (UsOnly)
Inventors
  • 정명영 JEONG, Myung Yung
  • 김창석 KIM, Chang Seok
  • 류진화 RYU, Jin Hwa
  • 오승훈 OH, Seung Hun
  • 이태호 LEE, Tae Ho
  • 조상욱 CHO, Sang Uk
Agents
  • 오위환 OH, Wi-Hwan
Priority Data
10-2010-001724325.02.2010KR
Publication Language Korean (ko)
Filing Language Korean (KO)
Designated States
Title
(EN) OPTICAL INTERCONNECTION METHOD FOR A PLANAR LIGHTWAVE CIRCUIT DEVICE
(FR) PROCÉDÉ D'INTERCONNEXION OPTIQUE POUR DISPOSITIF À CIRCUIT D'ONDE LUMINEUSE PLAN
(KO) 평면 광회로 소자의 광연결 방법
Abstract
(EN) The present invention relates to an optical interconnection method for a planar lightwave circuit (PLC) device, which simultaneously forms the PLC device and grooves for the insertion of optical fibers using a single imprint mold during the manufacture of the PLC device, and optically interconnects the PLC device and the grooves. The method comprises the following steps: forming a first pattern duplicating an original pattern using an original silicon master, and forming a second pattern duplicating an original pattern using the first pattern duplicating an original pattern; forming a lower clad using the second pattern duplicating an original pattern; forming a core layer on a channel cavity of the lower clad, and stacking an upper clad to form a PLC device chip; cutting an input end and an output end of the first pattern duplicating an original pattern, and arranging optical fibers in the grooves; and aligning the grooves having the optical fibers arranged therein with the PLC device chip, and optically interconnecting the grooves and the PLC device chip.
(FR) L'invention concerne un procédé d'interconnexion optique pour un dispositif à circuit d'onde lumineuse plan (PLC), qui permet de former simultanément le dispositif PLC et les gorges pour l'insertion de fibres optiques en utilisant un seul moule d'empreinte durant la fabrication du dispositif PLC, et qui interconnecte optiquement le dispositif PLC et les gorges. Le procédé comprend les étapes suivantes : former un premier motif dupliquant un motif original en utilisant un maître original en silicium et former un second motif dupliquant un motif original en utilisant le premier motif dupliquant le motif original ; former un premier revêtement inférieur en utilisant le second motif dupliquant un motif original ; former une couche centrale sur une cavité de canal du revêtement inférieur, et empiler un revêtement supérieur de manière à former une puce de dispositif PLC ; découper une extrémité d'entrée et une extrémité de sortie du premier motif dupliquant le motif original et disposer des fibres optiques dans les gorges ; et aligner les gorges dans lesquelles sont disposées les fibres optiques avec la puce de dispositif PLC, puis interconnecter optiquement les gorges et la puce de dispositif PLC.
(KO) 본 발명은 평면광파 회로(Planar Lightwave Circuit;PLC) 소자의 제조시에 단일의 임프린트 금형을 사용하여 PLC 소자와 광섬유 정렬을 위한 그루브(groove)를 동시에 제조하여 광결합을 할 수 있도록 한 평면 광회로 소자의 광연결 방법에 관한 것으로, 원형 실리콘 마스터(original master)를 사용하여 원형 복제 제 1 패턴을 형성하고, 원형 복제 제 1 패턴을 이용하여 원형 복제 제 2 패턴을 형성하는 단계;상기 원형 복제 제 2 패턴을 이용하여 하부 클레드를 형성하는 단계;상기 하부 클레드의 채널 캐비티에 코어층을 형성하고 상부 클레드를 적층하여 PLC 디바이스 칩을 형성하는 단계;상기 원형 복제 제 1 패턴의 입,출력단을 절단하고 그루브에 광 파이버를 실장하는 단계;상기 광 파이버가 실장된 그루브와 상기 PLC 디바이스 칩을 정렬하여 광결합하는 단계;를 포함한다.
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