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1. WO2011100190 - INTERCONNECT PATTERN FOR HIGH PERFORMANCE INTERFACES

Publication Number WO/2011/100190
Publication Date 18.08.2011
International Application No. PCT/US2011/023893
International Filing Date 07.02.2011
IPC
H01L 21/60 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
50Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/06-H01L21/326162
60Attaching leads or other conductive members, to be used for carrying current to or from the device in operation
H01L 23/48 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads or terminal arrangements
CPC
H01L 2223/6638
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2223Details relating to semiconductor or other solid state devices covered by the group H01L23/00
58Structural electrical arrangements for semiconductor devices not otherwise provided for
64Impedance arrangements
66High-frequency adaptations
6605High-frequency electrical connections
6638Differential pair signal lines
H01L 23/49838
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
488consisting of soldered ; or bonded; constructions
498Leads, ; i.e. metallisations or lead-frames; on insulating substrates, ; e.g. chip carriers
49838Geometry or layout
H01L 23/50
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
48Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; ; Selection of materials therefor
50for integrated circuit devices, ; e.g. power bus, number of leads
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H01L 2924/3011
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
30Technical effects
301Electrical effects
3011Impedance
H01R 12/7082
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
12Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCBs], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
70Coupling devices
7082Coupling device supported only by cooperation with PCB
Applicants
  • ALTERA CORPORATION [US]/[US] (AllExceptUS)
  • HUI, Liu [CA]/[US] (UsOnly)
Inventors
  • HUI, Liu
Agents
  • MORRIS, Francis, E.
Priority Data
12/702,82309.02.2010US
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) INTERCONNECT PATTERN FOR HIGH PERFORMANCE INTERFACES
(FR) MOTIF D'INTERCONNEXION POUR DES INTERFACES À HAUTES PERFORMANCES
Abstract
(EN) In one embodiment, differential signaling and ground contacts are located in a rectilinear array of rows and columns with ground contacts spaced apart by three times the pitch distance between adjacent rows or columns and signaling contacts are located immediately adjacent the ground contacts. In particular, the two contacts of each differential pair are located one pitch distance apart from each other and one contact of each differential pair of contacts is located one pitch distance from a ground contact and the other contact of the differential pair is located approximately sqrt(2)*pitch distance from the same ground contact. In a second embodiment, differential signaling and ground contacts are located in a hexagonal array with ground contacts located three times the pitch distance between adjacent contacts and signaling contacts located immediately adjacent the ground contacts. In particular, the two contacts of each differential pair are located one pitch distance apart from each other and both contacts of each differential pair of contacts are located one pitch distance from a ground contact.
(FR) Dans un mode de réalisation, une signalisation différentielle et des contacts de masse se situent dans un réseau rectiligne de rangées et de colonnes, les contacts de masse étant espacés d'une distance égale à trois fois la distance de pas entre des rangées ou des colonnes adjacentes et les contacts de signalisation se situant immédiatement adjacents aux contacts de masse. En particulier, les deux contacts de chaque paire différentielle se situent à une distance égale à un pas l'un de l'autre et un contact de chaque paire différentielle de contacts se situe à une distance égale à un pas d'un contact de masse et l'autre contact de la paire différentielle se situe approximativement à une distance égale à la racine carrée de (2) fois la distance de pas par rapport au même contact de masse. Dans un second mode de réalisation, la signalisation différentielle et les contacts de masse se situent dans un réseau hexagonal, les contacts de masse se situant à une distance égale à trois fois la distance de pas entre des contacts adjacents et les contacts de signalisation se situant immédiatement adjacents aux contacts de masse. En particulier, les deux contacts de chaque paire différentielle se situent à une distance égale à un pas l'un de l'autre et les deux contacts de chaque paire différentielle de contacts se situent à une distance égale à un pas à partir d'un contact de masse.
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