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1. WO2011095406 - POWER MODULE HAVING A CIRCUIT ASSEMBLY, ELECTRICAL/ELECTRONIC CIRCUIT ASSEMBLY, METHOD FOR PRODUCING A POWER MODULE

Publication Number WO/2011/095406
Publication Date 11.08.2011
International Application No. PCT/EP2011/050894
International Filing Date 24.01.2011
IPC
H01L 23/373 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373Cooling facilitated by selection of materials for the device
H01L 23/433 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
42Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
433Auxiliary members characterised by their shape, e.g. pistons
CPC
H01L 2224/32225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
26Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
31Structure, shape, material or disposition of the layer connectors after the connecting process
32of an individual layer connector
321Disposition
32151the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
32221the body and the item being stacked
32225the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L 2224/48227
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
481Disposition
48151Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
48221the body and the item being stacked
48225the item being non-metallic, e.g. insulating substrate with or without metallisation
48227connecting the wire to a bond pad of the item
H01L 2224/48472
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
484Connecting portions
4847the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
48472the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
H01L 2224/73265
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
73Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
732Location after the connecting process
73251on different surfaces
73265Layer and wire connectors
H01L 23/3735
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
373Cooling facilitated by selection of materials for the device ; or materials for thermal expansion adaptation, e.g. carbon
3735Laminates or multilayers, e.g. direct bond copper ceramic substrates
H01L 23/4334
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
433Auxiliary members ; in containers; characterised by their shape, e.g. pistons
4334Auxiliary members in encapsulations
Applicants
  • ROBERT BOSCH GMBH [DE]/[DE] (AllExceptUS)
  • SUESKE, Erik [DE]/[DE] (UsOnly)
  • KEIL, Stefan [DE]/[DE] (UsOnly)
  • LEONHARDT, Matthias [DE]/[DE] (UsOnly)
  • LOEBLEIN, Joachim [DE]/[DE] (UsOnly)
  • WINKELMANN, Antje [DE]/[DE] (UsOnly)
Inventors
  • SUESKE, Erik
  • KEIL, Stefan
  • LEONHARDT, Matthias
  • LOEBLEIN, Joachim
  • WINKELMANN, Antje
Common Representative
  • ROBERT BOSCH GMBH
Priority Data
10 2010 001 565.204.02.2010DE
Publication Language German (de)
Filing Language German (DE)
Designated States
Title
(DE) LEISTUNGSMODUL MIT EINER SCHALTUNGSANORDNUNG, ELEKTRISCHE/ELEKTRONISCHE SCHALTUNGSANORDNUNG, VERFAHREN ZUR HERSTELLUNG EINES LEISTUNGSMODULS
(EN) POWER MODULE HAVING A CIRCUIT ASSEMBLY, ELECTRICAL/ELECTRONIC CIRCUIT ASSEMBLY, METHOD FOR PRODUCING A POWER MODULE
(FR) MODULE DE PUISSANCE POURVU D'UN CIRCUIT, CIRCUIT ÉLECTRIQUE/ÉLECTRONIQUE, ET PROCÉDÉ DE FABRICATION D'UN MODULE DE PUISSANCE
Abstract
(DE) Die Erfindung betrifft ein Leistungsmodul (2) mit einer Schaltungsanordnung (4), die mindestens ein auf einem Substrat (5) angeordnetes Leistungselement (7) umfasst, wobei die Schaltungsanordnung (4) zumindest bereichsweise durch ein Mold-Gehäuse (16) eingehaust ist. Dabei ist vorgesehen, dass dem Substrat (5) eine bereichsweise miteingehauste Wärmesenke (9) aus einem Metall-Keramik-Verbundwerkstoff (10) mit einem in Richtung des Substrats (5) zunehmenden Keramikanteil zugeordnet ist. Ferner betrifft die Erfindung eine Leistungseinrichtung (1). Schließlich betrifft die Erfindung ein Verfahren zur Herstellung eines Leistungsmoduls.
(EN) The invention relates to a power module (2) having a circuit assembly (4) which comprises at least one power element (7) arranged on a substrate (5), wherein the circuit assembly (4) is housed at least in regions by a mold housing (16). According to the invention, a heatsink (9), also housed in sections and made of a metal/ceramic composite material (10) and having an increasing ceramic content in the direction of the substrate (5), is allocated to the substrate (5). The invention further relates to a power apparatus (1). Finally, the invention relates to a method for producing a power module.
(FR) L'invention concerne un module de puissance (2) pourvu d'un circuit (4) qui comprend au moins un élément de puissance (7) disposé sur un substrat (5), ledit circuit (4) étant logé au moins en partie par un boîtier moulé (16). Selon l'invention, est associé au substrat (5) un dissipateur de chaleur (9) logé en partie dans le boîtier, ledit dissipateur de chaleur consistant en un matériau composite métal-céramique (10) dont la proportion de céramique augmente en direction du substrat (5). L'invention concerne également un dispositif de puissance (1). L'invention concerne enfin un procédé de fabrication d'un module de puissance.
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