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1. WO2011093182 - HEAT DISSIPATION SHEET AND METHOD FOR PRODUCING HEAT DISSIPATION SHEET

Publication Number WO/2011/093182
Publication Date 04.08.2011
International Application No. PCT/JP2011/050837
International Filing Date 19.01.2011
IPC
H01L 23/36 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
B32B 15/08 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products essentially comprising metal
04comprising metal as the main or only constituent of a layer, next to another layer of a specific substance
08of synthetic resin
H01L 23/373 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heat sinks
373Cooling facilitated by selection of materials for the device
H05K 7/20 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
CPC
B32B 15/08
BPERFORMING OPERATIONS; TRANSPORTING
32LAYERED PRODUCTS
BLAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
15Layered products comprising ; a layer of; metal
04comprising metal as the main or only constituent of a layer, ; which is; next to another layer of ; the same or of; a ; different material
08of synthetic resin
H01L 23/36
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
H01L 23/373
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
373Cooling facilitated by selection of materials for the device ; or materials for thermal expansion adaptation, e.g. carbon
H01L 23/3737
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
373Cooling facilitated by selection of materials for the device ; or materials for thermal expansion adaptation, e.g. carbon
3737Organic materials with or without a thermoconductive filler
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H05K 7/20
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
Applicants
  • 有限会社アイレックス IREX INC. [JP]/[JP] (AllExceptUS)
  • 純正化学株式会社 JUNSEI CHEMICAL CO.,LTD. [JP]/[JP] (AllExceptUS)
  • 横倉 裕久 YOKOKURA, Takahisa [JP]/[JP] (UsOnly)
  • 益田 英之 MASUDA, Hideyuki [JP]/[JP] (UsOnly)
Inventors
  • 横倉 裕久 YOKOKURA, Takahisa
  • 益田 英之 MASUDA, Hideyuki
Agents
  • 岡田 宏之 OKADA, Hiroyuki
Priority Data
2010-01421926.01.2010JP
Publication Language Japanese (ja)
Filing Language Japanese (JA)
Designated States
Title
(EN) HEAT DISSIPATION SHEET AND METHOD FOR PRODUCING HEAT DISSIPATION SHEET
(FR) FEUILLE DE DISSIPATION DE CHALEUR, ET PROCÉDÉ DE FABRICATION DE CELLE-CI
(JA) 放熱シート及び放熱シートの製造方法
Abstract
(EN) Disclosed is a heat dissipation sheet, which has thermal characteristics capable of efficiently dissipating the heat generated by a heat generating device, and wherein residual chlorine is not present in a conductive polymer-impregnated sheet. Specifically disclosed is a heat dissipation sheet, which has a configuration wherein a metal layer (16) or (20) is closely bonded to both or one of the main surface (18a) and the back surface (18b) of a sulfur-containing π-conjugated conductive polymer-impregnated sheet (18) which is impregnated with a sulfur-containing π-conjugated conductive polymer that is obtained by polymerization using an iron (III) aromatic sulfonate serving as an oxidizing agent. The sulfur-containing π-conjugated conductive polymer-impregnated sheet is produced by immersing a sheet-like base into a solution that is obtained by diluting an iron (III) aromatic sulfonate with a first solvent and then immersing the resulting sheet-like base into a solution that is obtained by diluting a sulfur-containing π-conjugated conductive polymer-forming substance with a second solvent, thereby causing a polymerization reaction.
(FR) L'invention concerne une feuille de dissipation de chaleur exempte de chlore résiduel dans une feuille imprégnée d'un polymère conducteur, et possédant des caractéristiques thermiques permettant une dissipation efficace de la chaleur générée par un dispositif de génération de chaleur. Plus précisément, l'invention concerne une feuille de dissipation de chaleur qui présente une configuration telle que sur la face principale (18a) et / ou la face arrière (18b) d'une feuille (18) imprégnée d'un polymère conducteur π-conjugué contenant du soufre qui a été imprégnée d'un polymère conducteur π-conjugué contenant du soufre polymérisé à l'aide d'un second fer d'acide sulfonique aromatique constituant un oxydant, est mis en adhésion une couche métallique (16) ou (20). Après imprégnation dans une solution dans laquelle le second fer d'acide sulfonique aromatique est dilué avec un premier solvant, la feuille imprégnée d'un polymère conducteur π-conjugué contenant du soufre est fabriquée par imprégnation et réaction de polymérisation dans une solution dans laquelle une substance formant le polymère conducteur π-conjugué contenant du soufre est diluée avec un second solvant.
(JA)  導電性重合体浸潤シートに残留塩素が存在せず、かつ、発熱デバイスが発生する熱を効率よく放散することが可能であるという熱的特性を有する。酸化剤である芳香族スルホン酸第2鉄を用いて重合された含硫黄π共役系導電性重合体が浸潤された含硫黄π共役系導電性重合体浸潤シート18の主面18a及び裏面18bの双方又はいずれか一方の面に金属層16又は20が密着された構成の放熱シートである。含硫黄π共役系導電性重合体浸潤シートは、芳香族スルホン酸第2鉄を第1溶媒で希釈した溶液に浸潤させた後、含硫黄π共役系導電性重合体形成物質を第2溶媒で希釈した溶液に浸潤し重合反応させて製造する。
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