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1. WO2011083953 - WAFER POLISHING APPARATUS

Publication Number WO/2011/083953
Publication Date 14.07.2011
International Application No. PCT/KR2011/000034
International Filing Date 05.01.2011
IPC
H01L 21/304 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
CPC
B24B 37/08
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
04designed for working plane surfaces
07characterised by the movement of the work or lapping tool
08for double side lapping
B24B 37/11
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
37Lapping machines or devices; Accessories
11Lapping tools
B24D 13/12
BPERFORMING OPERATIONS; TRANSPORTING
24GRINDING; POLISHING
DTOOLS FOR GRINDING, BUFFING, OR SHARPENING
13Wheels having flexibly-acting working parts, e.g. buffing wheels; Mountings therefor
02acting by their periphery
12comprising assemblies of felted or spongy material, e.g. felt, steel wool, foamed latex
Applicants
  • LG SILTRON INC. [KR]/[KR] (AllExceptUS)
  • LEE, Hyung Rak [KR]/[KR] (UsOnly)
Inventors
  • LEE, Hyung Rak
Agents
  • SEO, Kyo Jun
Priority Data
10-2010-000231111.01.2010KR
Publication Language English (en)
Filing Language English (EN)
Designated States
Title
(EN) WAFER POLISHING APPARATUS
(FR) APPAREIL DE POLISSAGE DE TRANCHE
Abstract
(EN) A wafer polishing apparatus is provided. The wafer polishing apparatus includes a first polishing roller disposed on a wafer, the first polishing roller extending in a direction in which the wafer extends and a second polishing roller disposed under the wafer, the second polishing roller extending in the direction in which the wafer extends. The wafer polishing apparatus uses the roller to polish the wafer. Thus, the wafer polishing apparatus may easily polish a wafer having a large area.
(FR) La présente invention a trait à un appareil de polissage de tranche. L'appareil de polissage de tranche comprend un premier rouleau à polir disposé sur une tranche, ledit premier rouleau à polir s'étendant dans une direction dans laquelle la tranche s'étend, et un second rouleau à polir disposé sous la tranche, ledit second rouleau à polir s'étendant dans la direction dans laquelle la tranche s'étend. L'appareil de polissage de tranche utilise le rouleau afin de polir la tranche. De la sorte, l'appareil de polissage de tranche peut facilement polir une tranche ayant une grande surface.
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