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1. WO2011077968 - CIRCUIT MODULE MANUFACTURING METHOD, CIRCUIT MODULE, AND ELECTRONIC APPARATUS PROVIDED WITH CIRCUIT MODULE

Publication Number WO/2011/077968
Publication Date 30.06.2011
International Application No. PCT/JP2010/072199
International Filing Date 10.12.2010
IPC
H01L 25/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices
H05K 3/00 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
CPC
H01L 2224/16225
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
10Bump connectors; Manufacturing methods related thereto
15Structure, shape, material or disposition of the bump connectors after the connecting process
16of an individual bump connector
161Disposition
16151the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
16221the body and the item being stacked
16225the item being non-metallic, e.g. insulating substrate with or without metallisation
H01L 23/5383
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another ; , i.e. interconnections, e.g. wires, lead frames
538the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
5383Multilayer substrates
H01L 23/5385
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
52Arrangements for conducting electric current within the device in operation from one component to another ; , i.e. interconnections, e.g. wires, lead frames
538the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
5385Assembly of a plurality of insulating substrates
H01L 25/162
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
25Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; ; Multistep manufacturing processes thereof
16the devices being of types provided for in two or more different main groups of H01L27/00 - H01L49/00 ; and H01L51/00; , e.g. forming hybrid circuits
162the devices being mounted on two or more different substrates
H01L 2924/09701
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
095with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
097Glass-ceramics, e.g. devitrified glass
09701Low temperature co-fired ceramic [LTCC]
H05K 1/141
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
14Structural association of two or more printed circuits
141One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
Applicants
  • 株式会社村田製作所 Murata Manufacturing Co.,Ltd. [JP]/[JP] (AllExceptUS)
  • 川手 俊矢 KAWATE Toshiya [JP]/[JP] (UsOnly)
Inventors
  • 川手 俊矢 KAWATE Toshiya
Agents
  • 福永 正也 FUKUNAGA Masaya
Priority Data
2009-29091922.12.2009JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) CIRCUIT MODULE MANUFACTURING METHOD, CIRCUIT MODULE, AND ELECTRONIC APPARATUS PROVIDED WITH CIRCUIT MODULE
(FR) PROCÉDÉ DE FABRICATION DE MODULE DE CIRCUIT, MODULE DE CIRCUIT ET APPAREIL ÉLECTRONIQUE ÉQUIPÉ DU MODULE DE CIRCUIT
(JA) 回路モジュールの製造方法、回路モジュール及び回路モジュールを備える電子機器
Abstract
(EN)
Disclosed is a circuit module manufacturing method, wherein circuit modules are manufactured at low cost with suppressed material cost by reducing a portion not to be used as a terminal electrode substrate in a collective substrate, from which terminal electrode substrates are to be cut out, and coplanarity of the circuit modules is improved. The circuit modules (1) are manufactured by dividing the collective substrate (30) having a plurality of electronic components (12, 13) mounted at least on one surface, and cutting out a plurality of circuit boards (11) from the collective substrate (30). A plurality of terminal electrode substrates (14), each of which is disposed at least over a plurality of the adjacent circuit boards (11), are mounted on one surface of the collective substrate (30), and the collective substrate (30), which has mounted thereon the terminal electrode substrate (14) on said surface, and the electronic components (12, 13) at least on one surface, is divided at positions where the circuit boards (11) are to be cut out.
(FR)
La présente invention a trait à un procédé de fabrication de module de circuit permettant de fabriquer des modules de circuit à faible coût avec une suppression du coût des matières en réduisant une partie qui ne doit pas être utilisée en tant que substrat d'électrode terminale dans un substrat collectif, de découper des substrats d'électrode terminale à partir des modules de circuit et d'améliorer la coplanarité des modules de circuit. Les modules de circuit (1) sont fabriqués en divisant le substrat collectif (30) doté d'une pluralité de composants électroniques (12, 13) montés au moins sur une surface et en découpant une pluralité de cartes de circuit imprimé (11) à partir du substrat collectif (30). Une pluralité de substrats d'électrode terminale (14), chacun d'entre eux étant disposé au moins au-dessus d'une pluralité de cartes de circuit imprimé adjacentes (11), est montée sur une surface du substrat collectif (30) et le substrat collectif (30), sur lequel sont montés le substrat d'électrode terminale (14) sur ladite surface ainsi que les composants électroniques (12, 13) au moins sur une surface, est divisé à des emplacements où les cartes de circuit imprimé (11) doivent être découpées.
(JA)
 本発明は、端子電極基板を切り出す集合基板において端子電極基板として利用されない部分を減らすことで、材料費を抑えて安価に製造するとともに、回路モジュールのコプラナリティを向上させる。本発明は、少なくとも片面に複数の電子部品12、13を実装した集合基板30を分断して、集合基板30から複数の回路基板11を切り出すことで複数の回路モジュール1を製造し、少なくとも隣接する複数の回路基板11を跨ぐように配置してある端子電極基板14を、集合基板30の一方の面に複数実装し、一方の面に複数の端子電極基板14、及び少なくとも片面に複数の電子部品12、13を実装した集合基板30を、複数の回路基板11を切り出す位置で分断する。
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