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1. WO2011073716 - PROCESS FOR RECYCLING A SUBSTRATE.

Publication Number WO/2011/073716
Publication Date 23.06.2011
International Application No. PCT/IB2009/007972
International Filing Date 15.12.2009
IPC
H01L 21/762 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in or on a common substrate or of specific parts thereof; Manufacture of integrated circuit devices or of specific parts thereof
71Manufacture of specific parts of devices defined in group H01L21/7086
76Making of isolation regions between components
762Dielectric regions
CPC
H01L 21/76251
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
71Manufacture of specific parts of devices defined in group H01L21/70
76Making of isolation regions between components
762Dielectric regions ; , e.g. EPIC dielectric isolation, LOCOS; Trench refilling techniques, SOI technology, use of channel stoppers
7624using semiconductor on insulator [SOI] technology
76251using bonding techniques
Applicants
  • SOITEC [FR]/[FR] (AllExceptUS)
  • BELLE, Anne Laure [FR]/[FR] (UsOnly)
Inventors
  • BELLE, Anne Laure
Agents
  • DESORMIERE, Pierre-Louis
Priority Data
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) PROCESS FOR RECYCLING A SUBSTRATE.
(FR) PROCÉDÉ POUR RECYCLER UN SUBSTRAT
Abstract
(EN)
Process for recycling a support substrate (25) of a material substantially transparent to at least a wavelength of electromagnetic radiation, said process comprising: a) providing an initial substrate (10); b) forming (S1) an intermediate layer (15) on a bonding face of the support substrate (25) having an initial roughness, said intermediate layer (15) being of a material substantially transparent to at least a wavelength of electromagnetic radiation, c) forming (S2) an electromagnetic radiation absorbing layer (24) either on the bonding face (10b) of the initial substrate (10), and/or on the intermediate layer (15), d) bonding (S3) the initial substrate (10) to the support substrate (25) via the electromagnetic radiation absorbing layer (24), and e) carrying out irradiation (S4) of the electromagnetic radiation absorbing layer (24) through the support substrate (25) and the intermediate layer to induce separation of the support substrate (25) from the initial substrate.
(FR)
L'invention porte sur un procédé pour recycler un substrat de support (25) en un matériau sensiblement transparent à au moins une longueur d'ondes de rayonnement électromagnétique, ledit procédé comprenant : a) la disposition d'un substrat initial (10); b) la formation (S1) d'une couche intermédiaire (15) sur une face de liaison du substrat de support (25) ayant une rugosité initiale, ladite couche intermédiaire (15) étant en un matériau sensiblement transparent à au moins une longueur d'ondes de rayonnement électromagnétique; c) la formation (S2) d'une couche d'absorption de rayonnement électromagnétique (24) sur la face de liaison (10b) du substrat initial (10), et/ou sur la couche intermédiaire (15); d) la liaison (S3) du substrat initial (10) au substrat de support (25) par l'intermédiaire de la couche d'absorption de rayonnement électromagnétique (24); et e) la réalisation d'une irradiation (S4) de la couche d'absorption de rayonnement électromagnétique (24) à travers le substrat de support (25) et la couche intermédiaire afin d'induire une séparation du substrat de support (25) vis-à-vis du substrat initial.
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