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1. WO2011065999 - LINEAR DEPOSITION SOURCE

Publication Number WO/2011/065999
Publication Date 03.06.2011
International Application No. PCT/US2010/039093
International Filing Date 17.06.2010
IPC
C23C 14/24 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
24Vacuum evaporation
CPC
C23C 14/243
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
24Vacuum evaporation
243Crucibles for source material
C23C 14/26
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
24Vacuum evaporation
26by resistance or inductive heating of the source
C23C 14/562
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
14Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
22characterised by the process of coating
56Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
562for coating elongated substrates
Applicants
  • VEECO INSTRUMENTS INC. [US]/[US] (AllExceptUS)
  • CONROY, Chad [US]/[US] (UsOnly)
  • PRIDDY, Scott, Wayne [US]/[US] (UsOnly)
  • DAHLSTROM, Jacob, A. [US]/[US] (UsOnly)
  • BRESNAHAN, Rich [US]/[US] (UsOnly)
  • GOTTHOLD, David, William [US]/[US] (UsOnly)
  • PATRIN, John [US]/[US] (UsOnly)
Inventors
  • CONROY, Chad
  • PRIDDY, Scott, Wayne
  • DAHLSTROM, Jacob, A.
  • BRESNAHAN, Rich
  • GOTTHOLD, David, William
  • PATRIN, John
Agents
  • RAUSCHENBACH, Kurt
Priority Data
12/628,18930.11.2009US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) LINEAR DEPOSITION SOURCE
(FR) SOURCE DE DÉPOSITION LINÉAIRE
Abstract
(EN)
A deposition source includes at least one crucible for containing deposition material. A body includes a conductance channel with an input coupled to an output of the crucible. A heater increases a temperature of the crucible so that the crucible evaporates the deposition material into the conductance channel. A plurality of nozzles is coupled to an output of the conductance channel so that evaporated deposition material is transported from the crucible through the conductance channel to the plurality of nozzles where the evaporated deposition material is ejected from the plurality of nozzles to form a deposition flux. At least one of the plurality of nozzles includes a tube that is positioned proximate to the conductance channel so that the tube restricts an amount of deposition material supplied to the nozzle including the tube.
(FR)
L'invention porte sur une source de déposition, qui comprend au moins un creuset pour contenir un matériau de déposition. Un corps comprend un canal de conductance avec une entrée couplée à une sortie du creuset. Un élément chauffant augmente une température du creuset, de telle sorte que le creuset évapore le matériau de déposition dans le canal de conductance. Une pluralité de buses sont couplées à une sortie du canal de conductance, de telle sorte qu'un matériau de déposition évaporé est transporté à partir du creuset, à travers le canal de conductance, vers la pluralité de buses, où le matériau de déposition évaporé est éjecté à partir de la pluralité de buses de façon à former un flux de déposition. Au moins l'une de la pluralité de buses comprend un tube qui est positionné à proximité du canal de conductance de telle sorte que le tube restreint une quantité de matériau de déposition délivrée à la buse comprenant le tube.
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