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1. WO2011039124 - OPTICAL ARRANGEMENT IN A PROJECTION EXPOSURE APPARATUS FOR EUV LITHOGRAPHY

Publication Number WO/2011/039124
Publication Date 07.04.2011
International Application No. PCT/EP2010/064198
International Filing Date 24.09.2010
IPC
G03F 7/20 2006.1
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printed surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
20Exposure; Apparatus therefor
G02B 7/00 2006.1
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
7Mountings, adjusting means, or light-tight connections, for optical elements
CPC
G02B 7/00
GPHYSICS
02OPTICS
BOPTICAL ELEMENTS, SYSTEMS, OR APPARATUS
7Mountings, adjusting means, or light-tight connections, for optical elements
G03F 7/70233
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
70216Systems for imaging mask onto workpiece
70233Optical aspects of catoptric systems
G03F 7/70808
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
708Construction of apparatus, e.g. environment, hygiene aspects or materials
70808Construction details, e.g. housing, load-lock, seals, windows for passing light in- and out of apparatus
G03F 7/70825
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
708Construction of apparatus, e.g. environment, hygiene aspects or materials
70808Construction details, e.g. housing, load-lock, seals, windows for passing light in- and out of apparatus
70825Mounting of individual elements, e.g. mounts, holders or supports
G03F 7/70891
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
708Construction of apparatus, e.g. environment, hygiene aspects or materials
70858Environment aspects, e.g. pressure of beam-path gas, temperature
70883of optical system
70891Temperature
G03F 7/70916
GPHYSICS
03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR;
7Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
70Exposure apparatus for microlithography
708Construction of apparatus, e.g. environment, hygiene aspects or materials
70908Hygiene, e.g. preventing apparatus pollution, mitigating effect of pollution, removing pollutants from apparatus; electromagnetic and electrostatic-charge pollution
70916Pollution mitigation, i.e. mitigating effect of contamination or debris, e.g. foil traps
Applicants
  • CARL ZEISS SMT GMBH [DE]/[DE] (AllExceptUS)
  • KULITSKY, Viktor [DE]/[DE] (UsOnly)
  • GELLRICH, Bernhard [DE]/[DE] (UsOnly)
  • XALTER, Stefan [DE]/[DE] (UsOnly)
  • KWAN, Yim-Bun-Patrick [GB]/[DE] (UsOnly)
  • DEUFEL, Peter [DE]/[DE] (UsOnly)
  • WURMBRAND, Andreas [DE]/[DE] (UsOnly)
Inventors
  • KULITSKY, Viktor
  • GELLRICH, Bernhard
  • XALTER, Stefan
  • KWAN, Yim-Bun-Patrick
  • DEUFEL, Peter
  • WURMBRAND, Andreas
Agents
  • FRANK, Hartmut
Priority Data
10 2009 045 223.030.09.2009DE
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) OPTICAL ARRANGEMENT IN A PROJECTION EXPOSURE APPARATUS FOR EUV LITHOGRAPHY
(FR) DISPOSITIF OPTIQUE DANS UN APPAREIL D'EXPOSITION PAR PROJECTION POUR LITHOGRAPHIE EUV
Abstract
(EN)
The invention concerns an optical arrangement in a projection exposure apparatus for EUV lithography, comprising a multiplicity of optical elements (101, 102) and a carrier structure (100, 300) which carries the optical elements (101, 102), wherein the carrier structure is composed of at least two releasably interconnected modules (110-140, 310-340, 510, 610), and wherein each module (110-140, 310-340, 510, 610) is composed of at least one carrier structure subelement (121-124, 421, 511 -514, 612-614), wherein a subhousing is produced by a multiplicity of carrier structure subelements (121-124, 421, 511-514, 612-614) and/or modules (110-140, 310, 340, 510, 610), and wherein said subhousing has a geometry that varies, at least in regions, in correspondence to a usable beam path in said projection exposure apparatus, said usable beam path being defined as an envelope of all light bundles which can propagate from all field points in a field plane to an image plane of the projection exposure apparatus.
(FR)
L'invention concerne un dispositif optique utilisé dans un appareil d'exposition par projection pour lithographie EUV, lequel comprend de multiples éléments optiques (101, 102) et une structure de support (100, 300) qui supporte les éléments optiques (101, 102), laquelle structure de support comprend au moins deux modules (110-140, 310-340, 510, 610) interconnectés de manière amovible tandis que chacun de ces modules (110-140, 310-340, 510, 610) se compose d'au moins un sous-élément de structure de support (121-124, 421, 511-514, 612-614), un sous-boîtier étant formé par de multiples sous-éléments de structure de support (121-124, 421, 511-514, 612-614) et/ou modules (110-140, 310, 340, 510, 610), lequel sous-boîtier possède une géométrie qui varie, au moins dans certaines régions, en fonction d'un trajet de faisceau utilisable dans ledit appareil d'exposition par projection, ledit trajet de faisceau utilisable étant défini comme une enveloppe de tous les faisceaux de lumière qui peuvent se propager depuis tous les points de champ dans un plan de champ vers un plan d'image de l'appareil d'exposition par projection.
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