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1. WO2011035645 - LED LIGHT BULB WITH MULTIPLE LAYERS OF RADIATING STRUCTURES

Publication Number WO/2011/035645
Publication Date 31.03.2011
International Application No. PCT/CN2010/075355
International Filing Date 21.07.2010
IPC
F21V 29/00 2006.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
29Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
F21V 19/00 2006.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
19Fastening of light sources or lamp holders
F21S 2/00 2006.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
SNON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
2Systems of lighting devices, not provided for in main groups F21S4/-F21S10/113
F21V 23/00 2006.01
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
23Arrangement of electric circuit elements in or on lighting devices
H01L 33/00 2010.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
33Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
H01L 23/00 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
CPC
F21K 9/232
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
KNON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
9Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
20Light sources comprising attachment means
23Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
232specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
F21Y 2115/10
FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
21LIGHTING
YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
2115Light-generating elements of semiconductor light sources
10Light-emitting diodes [LED]
Applicants
  • 沈李豪 SHEN, Lihao [CN]/[CN]
Inventors
  • 沈李豪 SHEN, Lihao
Agents
  • 东莞市冠诚知识产权代理有限公司 DONGGUAN CITY GUANCHENG INTELLECTUAL PROPERTY AGENCY LTD
Priority Data
200920205331.327.09.2009CN
Publication Language Chinese (ZH)
Filing Language Chinese (ZH)
Designated States
Title
(EN) LED LIGHT BULB WITH MULTIPLE LAYERS OF RADIATING STRUCTURES
(FR) AMPOULE À LED À MULTIPLES COUCHES DE STRUCTURES RAYONNANTES
(ZH) 具有多层散热结构的LED灯泡
Abstract
(EN)
A LED light bulb with multiple layers of radiating structures, comprises a LED circuit carrier, a main body 02) of a lamp cup, a controller (04), LED chips (05) and a lamp cover (06). The LED circuit carrier can be a planar LED circuit carrier (10), which has an A base load surface (101) and the whole circle of the edge of which s folded into a wide edge (014). The LED circuit carrier can be also a cap-like LED circuit carrier (01), the center part of which is humped to form the first base load surface (011). The whole circle of the edge of the first base load surface (011) is folded into a wide edge (014), then folded again towards the circumambience and extends to form a brim-like second base load surface (012) and continues to form the Nth base load surface by analogy. The main body (02) of the lamp cup has a structure of multiple layers, and comprises the first layer amp cup (021), the second layer lamp cup (022), and till the Nth layer lamp cup by analogy. Each base load surface (101, 011, 012) is provided with a circuit board. The LED circuit carrier is made of heat conductive material. The main body (02) of the lamp cup is made of radiating material. Radiating vents (03) are densely distributed in the side walls of the second layer lamp cup (022) till the Nth layer lamp cup. The LED light bulb with multiple layers of radiating structures has a good radiating effect and a long life.
(FR)
Une ampoule à LED à multiples couches de structures rayonnantes comprend un porte-circuit à LED, un corps principal (02) d'une coupelle de lampe, un dispositif de commande (04), des puces à LED (05) et un abat-jour (06). Le porte-circuit à LED peut être un porte-circuit à LED plan (10), qui comporte une surface de charge de base (101) dont tout le cercle du bord est plié en un bord large (014). Le porte-circuit à LED peut être également un porte-circuit à LED du type chapeau (01), dont la partie centrale fait une bosse pour former la première surface de charge de base (011). Tout le cercle du bord de la première surface de charge de base (011) est plié en un large bord (014), puis replié vers la circonférence et s'étend pour former une seconde surface de charge de base du type bord (012) et continue pour former la nième surface de charge de base par analogie. Le corps principal (02) de la coupelle de lampe comporte une structure de multiples couches, et comprend la coupelle de lampe de première couche (021), la coupelle de lampe de deuxième couche (022), jusqu'à la coupelle de lampe de nième couche par analogie. Chaque surface de charge de base (101, 011, 012) est pourvue d'une carte de circuit imprimé. Le porte-circuit à LED se compose d'un matériau thermoconducteur. Le corps principal (02) de la coupelle de lampe se compose d'un matériau rayonnant. Des orifices de rayonnement (03) sont répartis de façon dense dans les parois latérales de la coupelle de lampe de seconde couche (022) jusqu'à la coupelle de lampe de nième couche. L'ampoule à LED pourvue de multiples couches de structures rayonnantes présente un bon effet de rayonnement et une longue durée de vie.
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