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1. WO2011034016 - COPPER METAL FILM, METHOD FOR PRODUCING SAME, COPPER METAL PATTERN, CONDUCTIVE WIRING LINE USING THE COPPER METAL PATTERN, COPPER METAL BUMP, HEAT CONDUCTION PATH, BONDING MATERIAL, AND LIQUID COMPOSITION

Publication Number WO/2011/034016
Publication Date 24.03.2011
International Application No. PCT/JP2010/065698
International Filing Date 13.09.2010
IPC
C23C 20/02 2006.1
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
20Chemical coating by decomposition of either solid compounds or suspensions of the coating forming compounds, without leaving reaction products of surface material in the coating
02Coating with metallic material
B22F 1/02 2006.1
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
1Special treatment of metallic powder, e.g. to facilitate working, to improve properties; Metallic powders per se, e.g. mixtures of particles of different composition
02comprising coating of the powder
H01B 1/20 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
1Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
20Conductive material dispersed in non-conductive organic material
H01B 5/14 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
5Non-insulated conductors or conductive bodies characterised by their form
14comprising conductive layers or films on insulating-supports
H01B 13/00 2006.1
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
BCABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
13Apparatus or processes specially adapted for manufacturing conductors or cables
H05K 1/09 2006.1
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
09Use of materials for the metallic pattern
CPC
B22F 1/02
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
1Special treatment of metallic powder, e.g. to facilitate working, to improve properties
02comprising coating of the powder
B22F 2201/01
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
2201Treatment under specific atmosphere
01Reducing atmosphere
B22F 2301/10
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
2301Metallic composition of the powder or its coating
10Copper
B22F 2302/25
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
2302Metal Compound, non-Metallic compound or non-metal composition of the powder or its coating
25Oxide
B22F 2999/00
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
2999Aspects linked to processes or compositions used in powder metallurgy
B22F 9/22
BPERFORMING OPERATIONS; TRANSPORTING
22CASTING; POWDER METALLURGY
FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER
9Making metallic powder or suspensions thereof
16using chemical processes
18with reduction of metal compounds
20starting from solid metal compounds
22using gaseous reductors
Applicants
  • 日立化成工業株式会社 HITACHI CHEMICAL COMPANY, LTD. [JP]/[JP] (AllExceptUS)
  • 中子 偉夫 NAKAKO, Hideo [JP]/[JP] (UsOnly)
  • 山本 和徳 YAMAMOTO, Kazunori [JP]/[JP] (UsOnly)
  • 神代 恭 KUMASHIRO, Yasushi [JP]/[JP] (UsOnly)
  • 横澤 舜哉 YOKOSAWA, Shunya [JP]/[JP] (UsOnly)
  • 増田 克之 MASUDA, Katsuyuki [JP]/[JP] (UsOnly)
  • 江尻 芳則 EJIRI, Yoshinori [JP]/[JP] (UsOnly)
  • 稲田 麻希 INADA, Maki [JP]/[JP] (UsOnly)
  • 黒田 杏子 KURODA, Kyoko [JP]/[JP] (UsOnly)
Inventors
  • 中子 偉夫 NAKAKO, Hideo
  • 山本 和徳 YAMAMOTO, Kazunori
  • 神代 恭 KUMASHIRO, Yasushi
  • 横澤 舜哉 YOKOSAWA, Shunya
  • 増田 克之 MASUDA, Katsuyuki
  • 江尻 芳則 EJIRI, Yoshinori
  • 稲田 麻希 INADA, Maki
  • 黒田 杏子 KURODA, Kyoko
Agents
  • 三好 秀和 MIYOSHI, Hidekazu
Priority Data
2009-21500316.09.2009JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) COPPER METAL FILM, METHOD FOR PRODUCING SAME, COPPER METAL PATTERN, CONDUCTIVE WIRING LINE USING THE COPPER METAL PATTERN, COPPER METAL BUMP, HEAT CONDUCTION PATH, BONDING MATERIAL, AND LIQUID COMPOSITION
(FR) FILM DE MÉTAL EN CUIVRE, PROCÉDÉ POUR SA PRODUCTION, MOTIF DE MÉTAL EN CUIVRE, LIGNE DE CÂBLAGE CONDUCTRICE UTILISANT LE MOTIF DE MÉTAL EN CUIVRE, BOSSE DE CONNEXION DE MÉTAL EN CUIVRE, TRAJET DE CONDUCTION THERMIQUE, MATÉRIAU DE FIXATION ET COMPOSITION DE LIQUIDE
(JA) 金属銅膜及びその製造方法、金属銅パターン及びそれを用いた導体配線、金属銅バンプ、熱伝導路、接合材、並びに液状組成物
Abstract
(EN)
Disclosed are: a copper metal film which has good adhesion to a substrate, low volume resistivity, and good deep-part metal properties; and a method for producing a copper metal film, wherein the copper metal film can be produced by reducing a substrate to a deep part thereof without damaging the substrate. Specifically disclosed is a copper metal film that is characterized by being obtained by processing a copper-based particle deposited layer, which contains copper oxide as well as a transition metal in the form of a metal, an alloy or a transition metal complex containing a metal element, with a gaseous formic acid and/or formaldehyde that is heated to 120˚C or higher. The copper oxide is preferably copper (I) oxide and/or copper (II) oxide. The transition metal, alloy or metal complex are preferably a metal selected from the group consisting of Cu, Pd, Pt, Ni, Ag, Au and Rh, an alloy containing the metal, or a complex containing the metal element, respectively.
(FR)
L'invention porte sur : un film de métal en cuivre qui a une bonne adhérence à un substrat, une faible résistivité volumique et de bonnes propriétés de métal de partie profonde ; et un procédé pour produire un film de métal en cuivre, dans lequel procédé le film de métal en cuivre peut être produit par réduction d'un substrat à une partie profonde de celui-ci sans endommager le substrat. Il est décrit de façon spécifique un film de métal en cuivre, qui est caractérisé en ce qu'il est obtenu par traitement d'une couche déposée de particules à base de cuivre, qui contiennent de l'oxyde de cuivre ainsi qu'un métal de transition sous la forme d'un métal, d'un alliage ou d'un complexe de métal de transition contenant un élément métallique, avec un formaldéhyde et/ou un acide formique gazeux qui est chauffé à 120°C ou plus. L'oxyde de cuivre est de préférence de l'oxyde de cuivre (I) et/ou de l'oxyde de cuivre (II). Le métal de transition, l'alliage ou le complexe métallique sont de préférence un métal sélectionné parmi le groupe comprenant Cu, Pd, Pt, Ni, Ag, Au et Rh, un alliage contenant le métal, ou un complexe contenant l'élément métallique, respectivement.
(JA)
 基板密着性、低体積抵抗率、深部金属性の良好な金属銅膜、及び該金属銅膜を基板のダメージなく深部まで還元して製造し得る金属銅膜の製造方法を提供する。 銅酸化物と、金属状の遷移金属若しくは合金、又は金属元素を含む遷移金属錯体とを共に含有してなる銅系粒子堆積層を、120℃以上に加熱したガス状のギ酸及び/又はホルムアルデヒドにより処理してなることを特徴とする金属銅膜である。前記銅酸化物としては、酸化第一銅及び/又は酸化第二銅であることが好ましく、前記遷移金属、合金、又は金属錯体が、それぞれ、Cu、Pd、Pt、Ni、Ag、Au、及びRhからなる群より選択される金属、又は該金属を含む合金、又は該金属元素を含む錯体であることが好ましい。
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