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1. WO2011033647 - LASER BEAM MACHINE

Publication Number WO/2011/033647
Publication Date 24.03.2011
International Application No. PCT/JP2009/066349
International Filing Date 18.09.2009
IPC
B23K 26/06 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06Shaping the laser beam, e.g. by masks or multi-focusing
B23K 26/08 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
08Devices involving relative movement between laser beam and workpiece
B23K 26/10 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
08Devices involving relative movement between laser beam and workpiece
10using a fixed support
CPC
B23K 2101/18
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
2101Articles made by soldering, welding or cutting
18Sheet panels
B23K 26/0604
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
02Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
06Shaping the laser beam, e.g. by masks or multi-focusing
0604by a combination of beams
B23K 26/083
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
08Devices involving relative movement between laser beam and workpiece
083Devices involving movement of the workpiece in at least one axial direction
B23K 26/0869
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
26Working by laser beam, e.g. welding, cutting or boring
08Devices involving relative movement between laser beam and workpiece
0869Devices involving movement of the laser head in at least one axial direction
B23K 37/0408
BPERFORMING OPERATIONS; TRANSPORTING
23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
37Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
04for holding or positioning work
0408for planar work
Applicants
  • 株式会社片岡製作所 KATAOKA CORPORATION [JP]/[JP] (AllExceptUS)
  • 松本 潤一 MATSUMOTO, Junichi [JP]/[JP] (UsOnly)
Inventors
  • 松本 潤一 MATSUMOTO, Junichi
Agents
  • 赤澤 一博 AKAZAWA, Kazuhiro
Priority Data
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) LASER BEAM MACHINE
(FR) MACHINE À FAISCEAU LASER
(JA) レーザ加工機
Abstract
(EN)
A laser beam machine (1) is proposed which comprises holding means (2)to hold a substrate (O) with a working surface upward, working nozzles (3) for directing a laser beam onto the working surface of the substrate (O)while moving in the Y-direction, the nozzles also capable of moving in the X-direction, and supports (4) capable of moving in the X-direction relative to the substrate (O)while supporting the substrate (O) at its bottom surface. The present laser beam machine (1) moves the nozzles (3) relative to the substrate (O) to direct a laser beam at the point to be worked. When the nozzles are moved in the X-direction, the supports are also moved in the X-direction to prevent the laser beam from irradiating the supports (4). These features eliminate a step of turning-over when the substrate is transported to or out of the laser beam machine. The present laser machine occupies less installation space.
(FR)
L'invention porte sur une machine à faisceau laser (1) qui comprend un moyen de retenue (2) pour retenir un substrat (O) ayant une surface de travail vers le haut, des buses de travail (3) servant à projeter un faisceau laser sur la surface de travail du substrat (O) en même temps qu'elles se déplacent dans la direction Y, les buses étant aussi capables de se déplacer dans la direction X, et des supports (4) capables de se déplacer dans la direction X par rapport au substrat (O) en même temps qu'ils supportent le substrat (O) au niveau de sa surface inférieure. La machine à faisceau laser selon l'invention (1) déplace les buses (3) par rapport au substrat (O) pour diriger un faisceau laser sur le point à traiter. Lorsque les buses sont déplacées dans la direction X, les supports sont aussi déplacés dans la direction X pour empêcher le faisceau laser d'irradier les supports (4). Ces caractéristiques éliminent l'étape de retournement lorsque le substrat est transporté à la machine à faisceau laser ou en est évacué. La présente machine à laser occupe moins d'espace d'installation.
(JA)
 被加工面を上にした基板0を動かないよう保定する保定機構2と、Y軸方向に走行して基板0の被加工面にレーザ光を照射しかつX軸方向にも移動可能な加工ノズル3と、基板0を下方から支持しながらこの基板0に対してX軸方向に相対移動可能な支持機構4とを具備するレーザ加工機1を構成した。本レーザ加工機1では、レーザ加工時に基板0は動かさず、加工ノズル3を動かして所要部位にレーザ光を照射する。加工ノズル3をX軸方向に移動させる際には、支持機構4をもX軸方向に移動させて、支持機構4とレーザ光軸との干渉を回避する。これにより、レーザ加工機に対する基板の搬出入において基板の上下反転を不要とする。並びに、レーザ加工機自体の占有面積も削減する。
Also published as
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