Processing

Please wait...

Settings

Settings

Goto Application

1. WO2011033641 - ELECTRONIC DEVICE

Publication Number WO/2011/033641
Publication Date 24.03.2011
International Application No. PCT/JP2009/066301
International Filing Date 17.09.2009
IPC
H05K 3/34 2006.01
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
34by soldering
CPC
G01R 31/71
GPHYSICS
01MEASURING; TESTING
RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
31Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
50Testing of electric apparatus, lines, cables or components for short-circuits, continuity, leakage current or incorrect line connections
66Testing of connections, e.g. of plugs or non-disconnectable joints
70Testing of connections between components and printed circuit boards
71Testing of solder joints
H05K 1/0268
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
1Printed circuits
02Details
0266Marks, test patterns or identification means
0268for electrical inspection or testing
H05K 2201/0979
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2201Indexing scheme relating to printed circuits covered by H05K1/00
09Shape and layout
09209Shape and layout details of conductors
09654covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
0979Redundant conductors or connections, i.e. more than one current path between two points
H05K 2203/0271
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
2203Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
02Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
0271Mechanical force other than pressure, e.g. shearing or pulling
H05K 3/225
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
22Secondary treatment of printed circuits
225Correcting or repairing of printed circuits
H05K 3/341
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
3Apparatus or processes for manufacturing printed circuits
30Assembling printed circuits with electric components, e.g. with resistor
32electrically connecting electric components or wires to printed circuits
34by soldering
341Surface mounted components
Applicants
  • 株式会社 東芝 KABUSHIKI KAISHA TOSHIBA [JP]/[JP] (AllExceptUS)
  • 門田 朋子 MONDA, Tomoko [JP]/[JP] (UsOnly)
  • 向井 稔 MUKAI, Minoru [JP]/[JP] (UsOnly)
Inventors
  • 門田 朋子 MONDA, Tomoko
  • 向井 稔 MUKAI, Minoru
Agents
  • 鈴江 武彦 SUZUYE, Takehiko
Priority Data
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) ELECTRONIC DEVICE
(FR) DISPOSITIF ÉLECTRONIQUE
(JA) 電子機器
Abstract
(EN)
Provided is an electronic device including: a measurement unit (101) which measures a state amount of an electronic part; a database (102) which accumulates correlations between the state amount of the electronic part, information relating to the state of a junction connecting the electronic part to a circuit substrate, and the method for applying a weight to the junction in the direction in which the junction between the circuit substrate and the electronic part is compressed; a determination unit (103) which determines the method for applying a weight to the junction by using the database in accordance with the state of the electronic part acquired by the measurement unit; and a presentation unit (104) which presents the method for applying the weight to the junction.
(FR)
L'invention porte sur un dispositif électronique comprenant : une unité de mesure (101) qui mesure une quantité d'état d'une pièce électronique ; une base de données (102) qui accumule des corrélations entre la quantité d'état de la pièce électronique, des informations relatives à l'état d'une jonction connectant la pièce électronique à un substrat de circuit, et le procédé d'application d'un poids à la jonction dans la direction dans laquelle la jonction entre le substrat de circuit et la pièce électronique est compressée ; une unité de détermination (103) qui détermine le procédé d'application d'un poids à la jonction par utilisation de la base de données en fonction de l'état de la pièce électronique acquis par l'unité de mesure ; et une unité de présentation (104) qui présente le procédé d'application du poids à la jonction.
(JA)
 電子部品の状態量を測定する測定部(101)と、電子部品の状態量と、電子部品と回路基板を接合する接合部の状態に関する情報と、回路基板と電子部品の間で接合部が圧縮される方向に接合部に荷重を与える方法との相関を蓄積しているデータベース(102)と、データベースを用いて、測定部によって取得された電子部品の状態量から、接合部に荷重を与える方法を判断する判断部(103)と、接合部に荷重を与える方法を提示する提示部(104)と、を具備する電子機器。
Also published as
Latest bibliographic data on file with the International Bureau