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1. WO2011030917 - METHOD FOR CLEANING ARTICLE EMPLOYING ULTRASONIC WAVE

Publication Number WO/2011/030917
Publication Date 17.03.2011
International Application No. PCT/JP2010/065993
International Filing Date 09.09.2010
IPC
B08B 3/12 2006.01
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
3Cleaning by methods involving the use or presence of liquid or steam
04Cleaning involving contact with liquid
10with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity, by vibration
12by sonic or ultrasonic vibrations
A61B 19/00 2006.01
AHUMAN NECESSITIES
61MEDICAL OR VETERINARY SCIENCE; HYGIENE
BDIAGNOSIS; SURGERY; IDENTIFICATION
19Instruments, implements or accessories for surgery or diagnosis not covered by any of the groups A61B1/-A61B18/149
A61L 2/18 2006.01
AHUMAN NECESSITIES
61MEDICAL OR VETERINARY SCIENCE; HYGIENE
LMETHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION, OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS, OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS, OR SURGICAL ARTICLES
2Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
16using chemical substances
18Liquid substances
C23G 1/00 2006.01
CCHEMISTRY; METALLURGY
23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
GCLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
1Cleaning or pickling metallic material with solutions or molten salts
H01L 21/304 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus specially adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
02Manufacture or treatment of semiconductor devices or of parts thereof
04the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer, carrier concentration layer
18the devices having semiconductor bodies comprising elements of group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
30Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20-H01L21/26142
302to change the physical characteristics of their surfaces, or to change their shape, e.g. etching, polishing, cutting
304Mechanical treatment, e.g. grinding, polishing, cutting
CPC
A61B 90/70
AHUMAN NECESSITIES
61MEDICAL OR VETERINARY SCIENCE; HYGIENE
BDIAGNOSIS; SURGERY; IDENTIFICATION
90Instruments, implements or accessories specially adapted for surgery or diagnosis and not covered by any of the groups A61B1/00 - A61B50/00, e.g. for luxation treatment or for protecting wound edges
70Cleaning devices specially adapted for surgical instruments
A61L 2/025
AHUMAN NECESSITIES
61MEDICAL OR VETERINARY SCIENCE; HYGIENE
LMETHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION, OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS, OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS, OR SURGICAL ARTICLES
2Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
02using physical phenomena
025Ultrasonics
A61L 2/186
AHUMAN NECESSITIES
61MEDICAL OR VETERINARY SCIENCE; HYGIENE
LMETHODS OR APPARATUS FOR STERILISING MATERIALS OR OBJECTS IN GENERAL; DISINFECTION, STERILISATION, OR DEODORISATION OF AIR; CHEMICAL ASPECTS OF BANDAGES, DRESSINGS, ABSORBENT PADS, OR SURGICAL ARTICLES; MATERIALS FOR BANDAGES, DRESSINGS, ABSORBENT PADS, OR SURGICAL ARTICLES
2Methods or apparatus for disinfecting or sterilising materials or objects other than foodstuffs or contact lenses; Accessories therefor
16using chemical substances
18Liquid substances ; or solutions comprising solids or dissolved gases
186Peroxide solutions
B08B 3/123
BPERFORMING OPERATIONS; TRANSPORTING
08CLEANING
BCLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
3Cleaning by methods involving the use or presence of liquid or steam
04Cleaning involving contact with liquid
10with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity, by vibration
12by sonic or ultrasonic vibrations
123Cleaning travelling work, e.g. webs, articles on a conveyor
H01L 21/67051
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
67028for cleaning followed by drying, rinsing, stripping, blasting or the like
6704for wet cleaning or washing
67051using mainly spraying means, e.g. nozzles
H01L 21/67057
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
21Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; ; Apparatus not specifically provided for elsewhere
67005Apparatus not specifically provided for elsewhere
67011Apparatus for manufacture or treatment
67017Apparatus for fluid treatment
67028for cleaning followed by drying, rinsing, stripping, blasting or the like
6704for wet cleaning or washing
67057with the semiconductor substrates being dipped in baths or vessels
Applicants
  • 平川 善博 HIRAKAWA, Yoshihiro [JP]/[JP]
Inventors
  • 平川 善博 HIRAKAWA, Yoshihiro
Agents
  • 青木 篤 AOKI, Atsushi
Priority Data
2009-20935910.09.2009JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) METHOD FOR CLEANING ARTICLE EMPLOYING ULTRASONIC WAVE
(FR) PROCÉDÉ DE NETTOYAGE D'OBJET À L'AIDE D'UNE ONDE ULTRASONIQUE
(JA) 超音波を用いた物品の洗浄方法
Abstract
(EN)
Provided is a method for cleaning and sterilizing powerfully a surface of an article by use of an ultrasonic wave to remove oil and dirt adhering to the surface of the article. The method enables reduction of the cost of the installation and running of the apparatus for the continuous cleaning and sterilization. The apparatus has a pair of ultrasonic oscillators (4) arranged one above the other with the oscillating faces thereof counterposed below the water surface in a cleaning vessel (2) which holds cleaning-water (W) containing dissolved oxygen and nitrogen at high concentrations. A portion of the cleaning water containing dissolved oxygen and nitrogen at high concentrations is introduced into a narrow interspace region (7) between the oscillating faces of the ultrasonic oscillators at a flow rate of about 50 cm/min with the amount and rate of the water flow controlled by a baffle plate (8). The side wall of the cleaning vessel (2) has an opening, through which a delivery conveyor (3) is installed for delivering a cleaning object (A). The cleaning water is allowed to flow out through the opening. The cleaning water to be fed to the cleaning vessel (2) is ejected into the inside of the opening to form a water curtain (Wa) to decrease the flow-out of a large amount of the water from the opening. The cleaning water falling from the opening is received by a water-receiving vessel (1) placed below, and pumped to a cleaning vessel (2) by a pump and cyclically used.
(FR)
La présente invention se rapporte à un procédé destiné à nettoyer et à stériliser fortement une surface d'un objet à l'aide d'une onde ultrasonique afin de retirer l'huile et la saleté adhérant à la surface de l'objet. Le procédé permet la réduction du coût de l'installation et du fonctionnement de l'appareil pour le nettoyage et la stérilisation continus. L'appareil comporte deux oscillateurs ultrasoniques (4) placés l'un au-dessus de l'autre, les faces d'oscillation de ces derniers étant disposés en contresens sous la surface d'eau dans un récipient de nettoyage (2) qui contient de l'eau de nettoyage (W) contenant de l'oxygène et de l'azote dissous à des concentrations élevées. Une partie de l'eau de nettoyage contenant l'oxygène et l'azote dissous à des concentrations élevées est introduite dans une région intercalée étroite (7) entre les faces d'oscillation des oscillateurs ultrasoniques à un débit d'environ 50 cm/min, la quantité et la vitesse de l'écoulement d'eau étant commandées par une plaque de déflexion (8). La paroi latérale du récipient de nettoyage (2) comporte une ouverture, par laquelle un transporteur de distribution (3) est installé pour distribuer un objet de nettoyage (A). L'eau de nettoyage est autorisée à s'écouler par l'ouverture. L'eau de nettoyage à acheminer jusqu'au récipient de nettoyage (2) est éjectée à l'intérieur de l'ouverture pour former un rideau d'eau (Wa) afin de diminuer l'écoulement sortant d'une grande quantité de l'eau par l'ouverture. L'eau de nettoyage tombant par l'ouverture est reçue par un récipient de réception d'eau (1) placé au-dessous, et pompée jusqu'à un récipient de nettoyage (2) par une pompe et utilisée de manière cyclique.
(JA)
 物品の表面に付着した脂・汚れ等を超音波を用いて強力に洗浄し且つ強く殺菌させることができる超音波洗浄方法を提供する。更に連続的に洗浄殺菌できる設備の費用とそのランニングコストを廉価にできるようにする。 酸素と窒素を高濃度に溶存させた洗浄水(W)を貯えた洗浄槽(2)の水面下に発振面が対向するように上下一対の超音波振動子(4)を配置し同超音波振動子の発振面間の狭間領域(7)に酸素と窒素を高濃度に溶存させた洗浄水の一部を邪魔板(8)で水量・流速を抑えて略50cm/分の流速で流入させる。洗浄槽(2)の側面を開口し、同開口を介して被洗浄物(A)を通過させる搬送コンベヤ(3)を配置し、同開口から洗浄水を排出させ、同開口の内側に洗浄槽(2)へ供給する洗浄水を噴出して水カーテン(Wa)を形成して開口からの大量の排水を抑え、又開口から落下した洗浄水を下方の受水槽(1)で受けてボンプで洗浄槽(2)へ圧送して洗浄水を循環的に使用する。
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