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1. WO2011025988 - ARCHITECTURE FOR GAS COOLED PARALLEL MICROCHANNEL ARRAY COOLER

Publication Number WO/2011/025988
Publication Date 03.03.2011
International Application No. PCT/US2010/047045
International Filing Date 27.08.2010
IPC
H01L 23/467 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
46involving the transfer of heat by flowing fluids
467by flowing gases, e.g. air
H01L 23/433 2006.01
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation
42Fillings or auxiliary members in containers selected or arranged to facilitate heating or cooling
433Auxiliary members characterised by their shape, e.g. pistons
CPC
H01L 23/4336
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
42Fillings or auxiliary members in containers ; or encapsulations; selected or arranged to facilitate heating or cooling
433Auxiliary members ; in containers; characterised by their shape, e.g. pistons
4336in combination with jet impingement
H01L 23/46
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
46involving the transfer of heat by flowing fluids
H01L 23/467
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
23Details of semiconductor or other solid state devices
34Arrangements for cooling, heating, ventilating or temperature compensation ; ; Temperature sensing arrangements
46involving the transfer of heat by flowing fluids
467by flowing gases, e.g. air
H01L 2924/0002
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
H05K 7/20136
HELECTRICITY
05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
7Constructional details common to different types of electric apparatus
20Modifications to facilitate cooling, ventilating, or heating
20009using a gaseous coolant in electronic enclosures
20136Forced ventilation, e.g. by fans
Applicants
  • RAYTHEON COMPANY [US]/[US] (AllExceptUS)
  • JOHNSON, Scott, T. [US]/[US] (UsOnly)
Inventors
  • JOHNSON, Scott, T.
Agents
  • GREEN, Robert, A.
Priority Data
61/238,09628.08.2009US
Publication Language English (EN)
Filing Language English (EN)
Designated States
Title
(EN) ARCHITECTURE FOR GAS COOLED PARALLEL MICROCHANNEL ARRAY COOLER
(FR) ARCHITECTURE POUR REFROIDISSEUR DE RÉSEAU DE MICROCANAUX PARALLÈLES REFROIDI AU GAZ
Abstract
(EN)
Effective utilization of a parallel flow air-cooled microchannel array at the micro electro mechanical systems (MEMS) scale is prohibited by unfavorable flow patterns in simple rectangular arrays. The primary problem encountered is the inability of the flow stream to penetrate a sufficient depth into the fin core to achieve the desired fin efficiency. Embodiments of the present invention overcome this problem using a manifold with open nozzle discharge and integrated lateral exhaust along with a microchannel array cooler with micro spreading cavities for internal air distribution.
(FR)
Une utilisation efficace d'un réseau de microcanaux refroidi à l'air à courant parallèle à l'échelle des microsystèmes électromécaniques est impossible en raison des configurations d'écoulement défavorables présentes dans les réseaux rectangulaires simples. Le principal problème rencontré réside dans l'incapacité du courant à pénétrer à une profondeur suffisante dans le noyau d'ailette afin d'obtenir l'efficacité d'ailette souhaitée. Des modes de réalisation de la présente invention résolvent ce problème grâce à l'utilisation d'un collecteur doté d'une décharge d'injecteur ouvert et d'un échappement latéral intégré ainsi que d'un refroidisseur de réseau de microcanaux doté de cavités de microdistribution pour la distribution d'air interne.
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