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1. WO2011024845 - NON-CONTACT COMMUNICATION MEDIUM

Publication Number WO/2011/024845
Publication Date 03.03.2011
International Application No. PCT/JP2010/064354
International Filing Date 25.08.2010
IPC
G06K 19/077 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
G06K 19/07 2006.01
GPHYSICS
06COMPUTING; CALCULATING OR COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards
07with integrated circuit chips
CPC
G06K 19/07735
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
0772Physical layout of the record carrier
07735the record carrier comprising means for protecting against electrostatic discharge
G06K 19/07749
GPHYSICS
06COMPUTING; CALCULATING; COUNTING
KRECOGNITION OF DATA; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
19Record carriers for use with machines and with at least a part designed to carry digital markings
06characterised by the kind of the digital marking, e.g. shape, nature, code
067Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards ; also with resonating or responding marks without active components
07with integrated circuit chips
077Constructional details, e.g. mounting of circuits in the carrier
07749the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
H01L 2224/45144
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
44Structure, shape, material or disposition of the wire connectors prior to the connecting process
45of an individual wire connector
45001Core members of the connector
45099Material
451with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
45138the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
45144Gold (Au) as principal constituent
H01L 2224/48091
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2224Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
42Wire connectors; Manufacturing methods related thereto
47Structure, shape, material or disposition of the wire connectors after the connecting process
48of an individual wire connector
4805Shape
4809Loop shape
48091Arched
H01L 2924/00011
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
0001Technical content checked by a classifier
00011Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
H01L 2924/01015
HELECTRICITY
01BASIC ELECTRIC ELEMENTS
LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
2924Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
01Chemical elements
01015Phosphorus [P]
Applicants
  • 凸版印刷株式会社 TOPPAN PRINTING CO., LTD. [JP]/[JP] (AllExceptUS)
  • 田中 洵介 TANAKA Junsuke [JP]/[JP] (UsOnly)
  • 水口 義之 MIZUGUCHI Yoshiyuki [JP]/[JP] (UsOnly)
Inventors
  • 田中 洵介 TANAKA Junsuke
  • 水口 義之 MIZUGUCHI Yoshiyuki
Priority Data
2009-19555726.08.2009JP
Publication Language Japanese (JA)
Filing Language Japanese (JA)
Designated States
Title
(EN) NON-CONTACT COMMUNICATION MEDIUM
(FR) SUPPORT DE COMMUNICATION SANS CONTACT
(JA) 非接触通信媒体
Abstract
(EN)
Disclosed is a non-contact communication medium capable of preventing static electricity from entering, and furthermore, capable of satisfying a requirement on the flatness of outer surfaces. Specifically disclosed is a non-contact communication medium that includes a sealing member having a lamination of an insulating layer and a conductive layer disposed so as to cover an IC module such that the insulating layer faces the IC module. With this structure, detrimental effects of static electricity exerted on the IC module can be reliably prevented since incoming static electricity is diffused by the conductive layer and blocked by the insulating layer. Furthermore, the non-contact communication medium can satisfy a requirement on the flatness of the outer surfaces.
(FR)
L'invention porte sur un support de communication sans contact capable d'empêcher de l'électricité statique de pénétrer, et en outre capable de satisfaire l'exigence de planéité de surfaces externes. L'invention porte de manière spécifique sur un support de communication sans contact qui comprend un élément de scellement étanche ayant une lamination d'une couche isolante et d'une couche conductrice disposées de façon à recouvrir un module CI de telle sorte que la couche isolante est tournée vers le module CI. Avec cette structure, les effets néfastes d'électricité statique exercés sur le module CI peuvent être empêchés de manière fiable, étant donné que l'électricité statique entrante est diffusée par la couche conductrice et bloquée par la couche isolante. En outre, le support de communication sans contact peut satisfaire une exigence de planéité des surfaces externes.
(JA)
【課題】静電気の侵入を防止することができ、さらに外表面の平坦性の要求を満たすことができる非接触通信媒体を提供する。 【解決手段】ICモジュールを覆う形状に、絶縁層と導電層とが重ねられた封止材が絶縁層をICモジュールの側に向けて配置することにより、飛来した静電気を導電層により拡散し、絶縁層により遮断することで、ICモジュールへの静電気の悪影響を確実に防止する非接触通信媒体を提供する。さらに外表面の平坦性の要求を満たすことができる非接触通信媒体を提供することができる。
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