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Machine translation
1. (WO2011022492) ADDING SYMMETRICAL FILLING MATERIAL IN AN INTEGRATED CIRCUIT LAYOUT
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2011/022492    International Application No.:    PCT/US2010/045908
Publication Date: 24.02.2011 International Filing Date: 18.08.2010
IPC:
H05K 3/00 (2006.01), H05K 3/10 (2006.01), H01L 23/50 (2006.01)
Applicants: QUALCOMM INCORPORATED [US/US]; Attn: International IP Administration 5775 Morehouse Drive San Diego, California 92121 (US) (For All Designated States Except US).
LIAO, Hongmei [CA/US]; (US) (For US Only)
Inventors: LIAO, Hongmei; (US)
Agent: GALLARDO, Michelle S.; Attn: International IP Administration 5775 Morehouse Drive San Diego, California 92121 (US)
Priority Data:
12/543,677 19.08.2009 US
Title (EN) ADDING SYMMETRICAL FILLING MATERIAL IN AN INTEGRATED CIRCUIT LAYOUT
(FR) AJOUT D'UN MATÉRIAU DE REMPLISSAGE SYMÉTRIQUE DANS UN AGENCEMENT DE CIRCUIT INTÉGRÉ
Abstract: front page image
(EN)In one embodiment, an integrated circuit has a conductive layer, where the conductive layer has a first set of regions and a second set of fill material regions, and the second set of fill material regions has a line of symmetry. Other embodiments are described and claimed.
(FR)Selon un mode de réalisation, un circuit intégré a une couche conductrice, la couche conductrice ayant un premier ensemble de régions et un second ensemble de régions de matériau de remplissage, le second ensemble de régions de matériau de remplissage ayant une ligne de symétrie. D'autres modes de réalisation sont décrits et revendiqués.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: English (EN)
Filing Language: English (EN)