WIPO logo
Mobile | Deutsch | Español | Français | 日本語 | 한국어 | Português | Русский | 中文 | العربية |
PATENTSCOPE

Search International and National Patent Collections
World Intellectual Property Organization
Search
 
Browse
 
Translate
 
Options
 
News
 
Login
 
Help
 
Machine translation
1. (WO2011021780) COMPOSITION FOR ANISOTROPIC CONDUCTIVE FILM
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2011/021780    International Application No.:    PCT/KR2010/004720
Publication Date: 24.02.2011 International Filing Date: 20.07.2010
IPC:
C08L 63/00 (2006.01), C08L 9/00 (2006.01), C08K 3/10 (2006.01), C08J 5/18 (2006.01)
Applicants: CHEIL INDUSTRIES INC. [KR/KR]; 290 Gongdan-dong, Gumi-si Gyeongsangbuk-do 730-710 (KR) (For All Designated States Except US).
PARK, Young-Woo [KR/KR]; (KR) (For US Only)
Inventors: PARK, Young-Woo; (KR)
Agent: AJU KIM CHANG & LEE; 6th Floor, Hubbahubba Building 648, Yeoksam-dong, Gangnam-gu Seoul 135-911 (KR)
Priority Data:
10-2009-0077079 20.08.2009 KR
Title (EN) COMPOSITION FOR ANISOTROPIC CONDUCTIVE FILM
(FR) COMPOSITION POUR FILM CONDUCTEUR ANISOTROPE
(KO) 이방 도전성 필름용 조성물
Abstract: front page image
(EN)The present invention relates to a composition for an anisotropic conductive film, comprising: an epoxy resin containing polycyclic aromatic rings; an acrylic rubber-based resin; conductive particles; and a hardener. After hardening, the epoxy resin containing polycyclic aromatic rings has a glass transition temperature (Tg) of 165°C to 220°C, the acrylic rubber-based resin has a Tg of 0°C to 20°C, and the combined content of the epoxy resin containing polycyclic aromatic rings and the acrylic rubber-based resin is 45 to 65 wt % of the overall weight percentage of the composition (solid portion). The composition for an anisotropic conductive film not only has both flexibility and impact resistance to compensate for the brittle property of epoxy resin under high temperature and high moisture conditions to prevent a hardened anisotropic conductive film from cracking, but can also lower connection resistance and can supplement thermal stability so as to exhibit high reliability and high adhesiveness.
(FR)La présente invention concerne une composition pour film conducteur anisotrope, comprenant : une résine époxy contenant des noyaux aromatiques polycycliques; une résine à base de caoutchouc acrylique; des particules conductrices; et un durcisseur. Après le durcissement, la résine époxy contenant des noyaux aromatiques polycycliques présente une température de transition vitreuse (Tg) de 165 °C à 220 °C, la résine à base de caoutchouc acrylique présente une Tg de 0 °C à 20 °C, et la teneur combinée de la résine époxy contenant des noyaux aromatiques polycycliques et de la résine à base de caoutchouc acrylique est de 45 à 65 % en poids du pourcentage pondéral total de la composition (partie solide). La composition pour un film conducteur anisotrope présente non seulement une flexibilité et une résistance aux impacts pour compenser la propriété cassante de la résine époxy dans des conditions de température et humidité élevées pour empêcher un film conducteur anisotrope durci de se fissurer, mais peut également diminuer la résistance au raccordement et augmenter la stabilité thermique de manière à présenter une fiabilité et une adhésivité de grande importance.
(KO)본 발명의 이방 도전성 필름용 조성물은 폴리사이클릭 방향족 고리 함유 에폭시 수지, 아크릴 고무계 수지, 도전성 입자 및 경화제를 포함하여 이루어지며, 상기 폴리사이클릭 방향족 고리 함유 에폭시 수지는 경화 후 유리전이온도(Tg)가 165°C~220°C 이고, 상기 아크릴 고무계 수지는 유리전이온도(Tg)가 0°C~20°C이며, 상기 폴리사이클릭 방향족 고리 함유 에폭시 수지와 아크릴 고무계 수지의 함량의 합은 전체 조성물(고형분) 중량의 45~65중량%인 것을 특징으로 한다. 상기 이방 도전성 필름용 조성물은 고온 고습 상태에서 에폭시 수지의 부서지기 쉬운(Brittle) 성질을 보완하여 경화 상태의 이방 도전성 필름이 깨지지 않도록 하는 유연성과 내충격성을 겸비할 뿐만 아니라 접속 저항을 낮추고, 열 안정성 부분을 보완하며, 고신뢰성과 고접착성을 발현할 수 있다.
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Korean (KO)
Filing Language: Korean (KO)