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Pub. No.:    WO/2011/021350    International Application No.:    PCT/JP2010/004792
Publication Date: 24.02.2011 International Filing Date: 28.07.2010
C08G 59/42 (2006.01), C08J 7/04 (2006.01), G03F 7/004 (2006.01), G03F 7/028 (2006.01), G03F 7/033 (2006.01)
Applicants: TAIYO HOLDINGS CO., LTD. [JP/JP]; 7-1, Hazawa 2-chome, Nerima-ku, Tokyo 1768508 (JP) (For All Designated States Except US).
MINEGISHI, Shoji [JP/JP]; (JP) (For US Only).
ARIMA, Masao [JP/JP]; (JP) (For US Only)
Inventors: MINEGISHI, Shoji; (JP).
ARIMA, Masao; (JP)
Agent: AMAGI INTERNATIONAL PATENT LAW OFFICE; SOLID SQUARE EAST TOWER 4F, 580, Horikawa-cho, Saiwai-ku, Kawasaki-shi, Kanagawa 2120013 (JP)
Priority Data:
2009-190197 19.08.2009 JP
(JA) 光硬化性樹脂組成物
Abstract: front page image
(EN)Disclosed is a photocurable resin composition which has reduced hygroscopicity and can improve the cold-heat-cycle resistance of a cured product of the photocurable resin composition without deteriorating the migration resistance properties thereof when the cured product is used in a printed wiring board or the like. The photocurable resin composition comprises a carboxylic acid-containing resin, a photopolymerization initiator, an epoxidated polybutadiene compound, and a maleimide compound.
(FR)L'invention porte sur une composition de résine photodurcissable qui a une hygroscopicité réduite et peut améliorer la résistance aux cycles froid-chaleur d'un produit durci de la composition de résine photodurcissable sans détériorer ses propriétés de résistance à la migration lorsque le produit durci est utilisé dans une carte imprimée ou similaire. La composition de résine photodurcissable comprend une résine à teneur en acide carboxylique, un amorceur de photopolymérisation, un composé polybutadiène époxydé et un composé maléimide.
(JA) 吸湿性を抑え、その硬化物において、プリント配線板等に用いられる際に、耐マイグレーション特性を損なうことなく冷熱サイクル耐性を向上させることが可能な光硬化性樹脂組成物を提供する。 光硬化性樹脂組成物において、カルボン酸含有樹脂、光重合開始剤、エポキシ化ポリブタジエン化合物及びマレイミド化合物を含有する。
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TH, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LR, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AL, AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Japanese (JA)
Filing Language: Japanese (JA)