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Machine translation
1. (WO2011020244) PACKING METHOD FOR BI-INTERFACE SMART CARD
Latest bibliographic data on file with the International Bureau   

Pub. No.:    WO/2011/020244    International Application No.:    PCT/CN2009/073379
Publication Date: 24.02.2011 International Filing Date: 20.08.2009
IPC:
G06K 19/077 (2006.01), H01R 4/02 (2006.01), H01L 21/60 (2006.01)
Applicants: SHANGHAI ESTAR TECHNOLOGY CO., LTD. [CN/CN]; Room B704(R), No.666, East Beijing Road, Huangpu District Shanghai 200001 (CN) (For All Designated States Except US).
YANG, Junliang [CN/CN]; (CN) (For US Only).
ZHONG, Wei [CN/CN]; (CN) (For US Only)
Inventors: YANG, Junliang; (CN).
ZHONG, Wei; (CN)
Agent: BEIJING ZBSD PATENT & TRADEMARK AGENT LTD.; 501/B, Fortune Building No.17 Daliushu Road Haidian District Beijing 100081 (CN)
Priority Data:
Title (EN) PACKING METHOD FOR BI-INTERFACE SMART CARD
(FR) PROCÉDÉ D'ASSEMBLAGE DE CARTE À PUCE À DEUX INTERFACES
(ZH) 一种双界面智能卡的封装工艺
Abstract: front page image
(EN)A packing method for bi-interface smart card involves the following steps: securing the module(8) of the bi-interface smart card to the card base(7) of the bi-interface smart card; welding the starting joint of the antenna(9) with one of the welding points(3); burying the antenna;welding the end joint of the antenna with the other welding point; infusing glue or filler in the welding through holes(5); finally laminating the welding layer with printing layer (11).
(FR)L'invention concerne un procédé d'assemblage d'une carte à puce à deux interfaces, qui comprend les étapes consistant à : fixer le module (8) de la carte à puce à deux interfaces à la base (7) de carte de la carte à puce à deux interfaces; souder le joint de début d'antenne (9) à un des points (3) de soudure; enfouir l'antenne; souder le joint de fin d'antenne à l'autre point de soudure; introduire de la colle ou une matière de remplissage dans les trous traversants (5) de soudure; et stratifier la couche de soudure avec une couche d'impression (11).
Designated States: AE, AG, AL, AM, AO, AT, AU, AZ, BA, BB, BG, BH, BR, BW, BY, BZ, CA, CH, CL, CN, CO, CR, CU, CZ, DE, DK, DM, DO, DZ, EC, EE, EG, ES, FI, GB, GD, GE, GH, GM, GT, HN, HR, HU, ID, IL, IN, IS, JP, KE, KG, KM, KN, KP, KR, KZ, LA, LC, LK, LR, LS, LT, LU, LY, MA, MD, ME, MG, MK, MN, MW, MX, MY, MZ, NA, NG, NI, NO, NZ, OM, PE, PG, PH, PL, PT, RO, RS, RU, SC, SD, SE, SG, SK, SL, SM, ST, SV, SY, TJ, TM, TN, TR, TT, TZ, UA, UG, US, UZ, VC, VN, ZA, ZM, ZW.
African Regional Intellectual Property Organization (BW, GH, GM, KE, LS, MW, MZ, NA, SD, SL, SZ, TZ, UG, ZM, ZW)
Eurasian Patent Organization (AM, AZ, BY, KG, KZ, MD, RU, TJ, TM)
European Patent Office (AT, BE, BG, CH, CY, CZ, DE, DK, EE, ES, FI, FR, GB, GR, HR, HU, IE, IS, IT, LT, LU, LV, MC, MK, MT, NL, NO, PL, PT, RO, SE, SI, SK, SM, TR)
African Intellectual Property Organization (BF, BJ, CF, CG, CI, CM, GA, GN, GQ, GW, ML, MR, NE, SN, TD, TG).
Publication Language: Chinese (ZH)
Filing Language: Chinese (ZH)